Chip electronic component and board for mounting the chip electronic component
An electronic component and chip technology, which is applied in the direction of printed circuits, electrical components, and printed electrical components that are connected to non-printed electrical components, can solve problems such as the limitation of inductor characteristics
Active Publication Date: 2018-03-13
SAMSUNG ELECTRO MECHANICS CO LTD
View PDF6 Cites 0 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0011] However, previous coil structures fabricated by substrate plating processes did not include the improved coil structure features described above
Therefore, coil patterns previously fabricated by substrate plating processes have limitations in the characteristics of inductors
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0029] Embodiments in the present disclosure will now be described in detail with reference to the accompanying drawings.
[0030] Embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the inventive concept to those skilled in the art. In the drawings, the shapes and sizes of elements may be exaggerated for clarity.
[0031] chip electronic components
[0032] A chip type electronic component according to an exemplary embodiment of the present disclosure, that is, a thin film type inductor will be described. However, the present disclosure is not limited thereto.
[0033] figure 1 is a schematic perspective view showing a chip-type electronic assembly according to an exemplary embodiment in the present disclosure, in figure 1 The internal coil pattern of the ch...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
| Property | Measurement | Unit |
|---|---|---|
| thickness | aaaaa | aaaaa |
Login to View More
Abstract
A chip electronic component is provided and the board used to install the electronic component.The film -type electronic component may include: the main body of magnetic materials, including insulation substrates, and at least one surface coil conductor formed on the insulation substrate; and the external electrode, set on the two ends of the main body of the magnetic material to connect to separately to connect to them separately to them respectivelyThe end of the coil conductor pattern.In the cross -section of the main length of the magnetic material, the thickness of the inner side ring / part of the coil conductor pattern can be smaller than the thickness of the other ring / part of the coil conductor pattern.
Description
[0001] This application claims the benefit of Korean Patent Application No. 10-2014-0060769 filed with the Korean Intellectual Property Office on May 21, 2014, the disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to a chip type electronic component and a board for mounting the chip type electronic component. Background technique [0003] Inductors, which are chip electronic components, may be representative passive elements constituting electronic circuits, and may be used for noise removal together with resistors and capacitors, for example. Such inductors can be combined with such capacitors using electromagnetic properties to construct circuits such as resonant circuits, filter circuits, etc. For example, such inductors can be used to amplify signals in specific frequency bands. [0004] Recently, since miniaturization and thinning of various information technology (IT) devices such as communication devices, ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Patents(China)
IPC IPC(8): H01F17/00H01F27/28H05K1/18
CPCH05K1/165H05K3/241H05K2201/0347H05K2201/086H05K2201/09727H05K2201/09736H05K2201/098H05K2201/10636H05K2203/1476H01F17/0013H01F2017/0066H01F2017/0073H01F27/292H05K2201/1003Y02P70/50H01F27/24H01F27/2804H01F2027/2809H05K1/111H05K1/181
Inventor 李东焕尹灿车慧娫韩镇宇
Owner SAMSUNG ELECTRO MECHANICS CO LTD