The invention provides a thin-size
inductor full-page
processing method which comprises the steps that S1, a full-page double-layer coil is prepared and comprises a first face coil, a second face coil and an insulating layer located between the first face coil and the second face coil, and the first face coil and the second face coil are the same in thickness; and S2, magnetic
slurry is laid on the first face of the full-page double-layer coil,
grinding is conducted after curing is conducted till the full-page thickness is H1, and H1 is equal to A + h1 + h2. And S3, magnetic
slurry is laid on the second face of the full-page double-layer coil,
grinding is conducted after curing is conducted till the full-page thickness is H2, and H2 is equal to A + (H + h2) / 2. And S4, the first surface is ground again until the thickness of the whole plate is H, and a whole plate
inductor body is obtained. Wherein H is the final required thickness of the
inductor body, h1 is the thickness of the first
surface coil, h2 is the thickness of the double-layer coil insulating layer, and A is greater than (H-h2) / 2. According to the method, the precision requirement for
slurry laying is low, and meanwhile it is effectively guaranteed that the thicknesses of magnets covered by the upper coil and the lower coil are consistent.