Pre-drilling wet-type plating metal substrate and manufacturing method therefor

Abstract

The invention discloses a pre-drilling wet-type plating metal substrate and a manufacturing method therefor. The method comprises the steps: providing a polyimide film; carrying out the pre-drilling of a plurality of prebored holes on the polyimide film, and enabling the polyimide film to form a plurality of through holes; carrying out the cleaning of the surface of the polyimide film; carrying out the chemical deposition of the polyimide film, and enabling the surface of the polyimide film and the walls of the plurality of holes to form first metal layers; carrying out the electroplating deposition of the polyimide film, and forming a second metal layer above the first metal layers.

Description

technical field [0001] The invention relates to a pre-drilled wet-type electroplating metal substrate and its manufacturing method, in particular to a kind of FCCL which is drilled at a predetermined position before the metallization operation, and then performs the metallization operation, which can effectively reduce production costs and Meet the needs of thin lines, micro holes and high density. Background technique [0002] Flexible copper clad laminate (Flexiblecoppercladlaminate, FCCL) is widely used in the electronics industry as a circuit substrate (PCB). In addition to the advantages of lightness, thinness and flexibility, FCCL also has electrical properties, In addition to the excellent thermal performance and heat resistance, its low dielectric constant (Dk) enables rapid transmission of electrical signals, good thermal performance, easy cooling of components, and high glass transition temperature (Tg ), allowing the component to perform well at higher temperatur...

AI Technical Summary

Problems solved by technology

[0004] The existing flexible circuit board manufacturing method is to first drill the aforementioned flexible copper foil substrate, such as figure 1 and figure 2 As shown, a drilling operation is first performed on a substrate 12 with a copper layer 10, so that a plurality of through holes 14 are formed on the substrate 12, and then a conductive medium 16 is formed in the through holes 14 (such as traditional copper, electroplated copper and traditional Metallized micropores such as conductive graphite to form a conductive medium 16), and finally electroplate secondary copper 18 on the flexible metal substrate 12, so that the secondary copper 18 is formed on the top of the copper layer 10 and in the through hole 14, so that the The upper and lower circuits of the substrate 12 are connected. The manufacture of this kind of existing flexible circuit board is relatively cumbersome and the cost is high, and the secondary copper 18 is formed on the copper 10 of the substrate 12, which will cause the thickness of the circuit board to increase. increase, which is not conducive to the demand for thin lines and high density, and the traditional conductive interlayer 16 manufacturing method in the through hole 14 (such as traditional copper, electroplated copper and traditional conductive graphite and other metallized micro-holes), its thickness is relatively large, and it is also Detrimental to the need for microporation

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