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A kind of self-crosslinking type LED encapsulation resin and preparation method thereof
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A technology of LED encapsulation and adhesive resin, which is applied in the field of self-crosslinking LED encapsulation adhesive resin and its preparation, can solve the problems of poor compatibility and uneven mixing, and achieve the effects of mild reaction, simple preparation process, and convenient operation
Active Publication Date: 2017-12-01
浙江安贝新材料股份有限公司
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Problems solved by technology
It greatly reduces the technical problems such as uneven mixing and poor compatibility that are prone to occur in the current double-package silicone encapsulant
Method used
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Embodiment 1
[0034] A self-crosslinking type LED encapsulation adhesive resin, calculated in parts by weight, the composition and content of the raw materials used for its preparation are as follows:
[0035] 100 parts of phenyltrimethoxysilane
[0036] Diphenyldimethoxysilane 100 parts
[0037] Vinyl ring body 20 parts
[0038] Hydrogen-containing double head 30 parts
[0039] 20 parts of distilled water
[0040] Solvent 100 parts
[0041] Catalyst 0.03 part;
[0042] Described solvent is by toluene and benzene, calculates by weight ratio, namely toluene: benzene is the mixture that the ratio of 1:1 forms;
[0043] The catalyst is an aqueous solution of hydrochloric acid with a concentration of 38% by mass.
[0044] The above-mentioned preparation method of a self-crosslinking type LED encapsulation resin, the steps are as follows:
[0045] Add 100g of phenyltrimethoxysilane, 100g of diphenyldimethoxysilane, 20g of vinyl rings, 30g of hydrogen-containing double caps, 20g of distill...
Embodiment 2
[0053] A self-crosslinking type LED encapsulation adhesive resin, calculated in parts by weight, the composition and content of the raw materials used for its preparation are as follows:
[0054] 105 parts of phenyltrimethoxysilane
[0055] 120 parts of diphenyldimethoxysilane
[0056] Vinyl ring body 10 parts
[0057] Hydrogen-containing double head 50 parts
[0058] 60 parts of distilled water
[0059] Solvent 200 parts
[0060] Catalyst 0.05 parts
[0061] Described solvent is toluene;
[0062] The catalyst is an aqueous sulfuric acid solution with a concentration of 98% by mass.
[0063] The above-mentioned preparation method of a self-crosslinking type LED encapsulation resin, the steps are as follows:
[0064] Add 105g of phenyltrimethoxysilane, 120g of diphenyldimethoxysilane, 10g of vinyl ring, 50g of hydrogen-containing double head, 60g of distilled water, 200g of solvent, and 0.05g of catalyst into the container in sequence, and raise the temperature to 60 ℃,...
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Abstract
The invention discloses a self-crosslinking LED packaging adhesive resin and a preparation method thereof. The self-crosslinking type LED encapsulation resin is calculated in parts by weight, consisting of 100-105 parts of phenyltrimethoxysilane, 100-120 parts of diphenyldimethoxysilane, 10-20 parts of vinyl rings, Add 30-50 parts of hydrogen-containing double-head, 20-60 parts of distilled water, 100-200 parts of solvent and 0.03-0.05 parts of catalyst into the container in sequence, stir at 60-80°C for 3-5 hours, and then rise to 100-120 React for 4-8 hours under stirring at ℃, adjust the pH of the obtained reaction solution to 7, and then distill under reduced pressure to remove the solvent and residual water, and then obtain a self-crosslinking LED encapsulation resin with the characteristics of high light transmittance, high refractive index, etc. The resin can realize self-crosslinking curing reaction under certain conditions, and the cured product has a higher thermal decomposition temperature.
Description
technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a self-crosslinking LED packaging adhesive resin and a preparation method thereof. Background technique [0002] In recent years, the high-power LED packaging industry has developed rapidly, and organic silicon with high light transmittance, high refractive index and good thermal stability is used as high-power LED packaging materials. The silicone resin used for encapsulation is generally stored in double packages for low temperature storage. The vinyl phenyl silicone resin is in one package, and the cross-linking agent is in the other package. When encapsulating LEDs, it is prepared and used immediately, and then cured to complete the encapsulation. The main problems of such compounding are: on the one hand, when the refractive difference between vinyl phenyl silicone resin and crosslinking agent is large, the difference in molecular structure between the ...
Claims
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