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Conductive substrate and manufacturing method thereof

A technology of a conductive substrate and a manufacturing method, applied in the field of conductive technology, can solve complex problems and the like

Inactive Publication Date: 2015-12-16
INTERFACE OPTOELECTRONICS SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

From the above, it can be seen that the whole process has eight steps, which is relatively complicated.

Method used

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  • Conductive substrate and manufacturing method thereof
  • Conductive substrate and manufacturing method thereof
  • Conductive substrate and manufacturing method thereof

Examples

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no. 1 example

[0033] First introduce the first embodiment of the present invention below, please refer to figure 2 . The first embodiment of the present invention includes an insulating substrate 26 and a conductive material 28, the material of the insulating substrate 26 is glass, polymethyl methacrylate (PMMA), polycarbonate (PC), polyimide (PI) Or sapphire, the conductive material 28 is an example of conductive glue. The insulating substrate 26 has a plurality of patterned through holes 30 through itself, and each patterned through hole 30 includes a first opening (window) 32, a hole 34 and a second opening 36 from bottom to top. The diameter of the hole 32 is greater than or equal to the diameter of the hole 34 , the diameter of the second opening 36 is greater than or equal to the diameter of the hole 34 , and the first opening 32 , the hole 34 and the second opening 36 communicate with each other. The conductive material 28 fills up all the first holes 32 , all the holes 34 and all...

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Abstract

The invention discloses a conductive substrate and a manufacturing method thereof. Firstly, an insulated substrate is provided, the insulated substrate is provided with a plurality of patterned through holes passing through the insulated substrate, each patterned through hole comprises a first open hole, a hole and a second open hole from bottom to top, the aperture of the first open hole is larger than or the same as that of the hole, the aperture of the second open hole is larger than or the same as that of the hole, and the first open hole, the hole and the second open hole are communicated mutually; and then, a conductive material is formed in all first open holes, all the holes and all the second open holes and all holes are filled to enable a conductive gasket to form in all first open holes and all second open holes. The conductive gasket is formed in the through holes of the insulated substrate, and the purpose of simplifying the integrated circuit process is achieved.

Description

technical field [0001] The present invention relates to a conductive technology, and in particular to a conductive substrate and a manufacturing method thereof. Background technique [0002] The semiconductor integrated circuit (IC) industry has experienced rapid growth. Technological advances in IC materials and design have resulted in successive generations of IC production, each with smaller and more complex circuits than the previous generation. However, these advances have also increased the complexity of the IC manufacturing process, so the same progress is required in the IC manufacturing process to achieve more advanced integrated circuit IC manufacturing processes. In the course of IC innovation, functional density (ie, the number of interconnected devices per chip area) has generally increased, while geometry size (ie, the smallest component or line that can be created in a process) has also increased. Small. These shrinking processes typically increase product ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L23/12H01L23/49
CPCH01L21/4857H01L21/486
Inventor 杨岳峰黄彦衡
Owner INTERFACE OPTOELECTRONICS SHENZHEN