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Double-sided encapsulation shell for parallel seam welding

A technology of parallel seam welding and encapsulation of shells, which is applied in the direction of electrical components, electric solid devices, circuits, etc., and can solve problems such as the inability to apply double-sided packaging of integrated circuits

Active Publication Date: 2015-12-23
EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the technical problem that parallel seam welding cannot be applied to double-sided packaging of integrated circuits due to pin blocking, and then propose a double-sided packaging shell for parallel seam welding

Method used

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  • Double-sided encapsulation shell for parallel seam welding
  • Double-sided encapsulation shell for parallel seam welding
  • Double-sided encapsulation shell for parallel seam welding

Examples

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Embodiment Construction

[0020] In order to further explain the technical solutions of the present invention, specific examples are given below to illustrate in detail.

[0021] A double-sided encapsulation enclosure for parallel seam welding, such as figure 1 As shown, a sealed box 1 is included, and a partition 1a is arranged in the sealed box 1. The partition 1a divides the sealed box 1 into upper and lower two-layer box cavities, and a box cover 1b is arranged on each layer of box cavities, and each box cover 1b Seal welding with the sealing box 1 by parallel seam welding. Both the sealed box 1 and the box cover 1b are made of metal. A group of guide pillars 5 are respectively connected to both ends of the partition 1 a, and each guide pillar 5 is sealed and connected to the partition 1 a through a glass insulator 4 . One end of each guide post 5 is in the upper box cavity, and the other end is in the lower box cavity.

[0022] The upper surface of the separator 1a is connected to the upper sub...

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Abstract

The invention relates to a double-sided encapsulation shell for parallel seam welding. The double-sided encapsulation shell is characterized in that the shell comprises a metal sealing box (1), a partition board (1a) is arranged inside the sealing box (1), the partition board (1a) divides the sealing box (1) into an upper box cavity and a lower box cavity, and a metal box cover (1b) seal-welded to the sealing box (1) through parallel seam welding is arranged on each box cavity; the upper and lower surfaces of the partition board (1a) are respectively in insulation connection with upper and lower substrates (7a, 7b), the upper and lower substrates (7a, 7b) are electrically connected by a conductive medium, and circuit devices (8) are connected to the upper and lower substrates (7a, 7b); and a group of flat I / O pins (3) are led out from the side wall of the sealing box (1), each I / O pin (3) is in fixed insulation connection with the sealing box (1), and each I / O pin (3) is electrically connected with the upper substrate (7a) or the lower substrate (7b). By adopting the technical scheme, high-reliability double-sided parallel seam welding air-tight encapsulation can be realized, the length and width of encapsulation are reduced, and the encapsulation density is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a double-sided packaging of thick-film hybrid integrated circuits. Background technique [0002] Metal shell packaging is a high-precision packaging technology in microelectronic packaging. It has excellent electrical properties, good airtightness, and is not easily affected by external environmental factors. Therefore, it is widely used in the thick-film hybrid integrated circuit industry. Parallel seam welding packaging is an important process method to realize metal shell packaging. According to the different lead-out methods, there are two main types of commonly used metal shell packages suitable for parallel seam welding at present. One is the lead-out type from the bottom of the pin, that is, the lead wire is drawn out from the bottom of the shell, and the installed pins generally adopt dual-in-line Or four-sided in-line, suitable for plug-in installation; ...

Claims

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Application Information

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IPC IPC(8): H01L23/055H01L23/15
CPCH01L2224/48091H01L2924/19107H01L2924/00014
Inventor 李寿胜夏俊生肖雷侯育增褚志斌
Owner EAST CHINA INST OF OPTOELECTRONICS INTEGRATEDDEVICE
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