Semiconductor package and method of manufacturing same
A package and semiconductor technology, which is applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, and semiconductor/solid-state device components, etc., can solve problems such as the adverse effect of heat dissipation of the semiconductor package 100, improve electromagnetic shielding performance, and reduce overall warpage. The effect of curved, high heat dissipation characteristics
Active Publication Date: 2018-04-13
SAMSUNG SEMICON CHINA RES & DEV +1
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Problems solved by technology
In addition, since the chip 120 is encapsulated by the thicker encapsulation layer 130, the heat dissipation of the semiconductor package 100 is adversely affected.
Method used
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[0024] Embodiments of the invention will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. However, this invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will provide Those of ordinary skill in the art fully convey the concept of the embodiments of the present invention. In the following detailed description, numerous specific details are set forth by way of example in order to provide a thorough understanding of the relevant teachings. It will be apparent, however, to one skilled in the art that the present teachings may be practiced without such details. In other instances, well-known methods, procedures, components, and circuits have been described at a relatively high level and without detail in order to avoid unnecessa...
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The invention provides a semiconductor packaging part and a method for manufacturing the same. The semiconductor packaging part comprises a substrate, at least one chip, a packaging layer and a conductive elastic layer, wherein the at least one chip is arranged on the substrate; the packaging layer is arranged on the substrate and packages the at least one chip; and the conductive elastic layer is arranged in the area, outside the area occupied by the packaging layer, of the substrate and contacts at least one part of the packaging layer. In the semiconductor packaging part provided by the invention, one part of the epoxy resin packaging layer is replaced with the conductive elastic layer, so that the entire warping of the semiconductor packaging part can be reduced. In addition, the conductive elastic layer has high heat dispersion characteristics, so that the heat dispersion property of the semiconductor packaging part is improved. Furthermore, the conductive elastic layer is connected with the area in which a ground terminal of the substrate is located, so that the electromagnetic shield property of the semiconductor packaging part can be improved.
Description
technical field [0001] Exemplary embodiments of the present invention relate to the field of semiconductor packaging, and in particular, to a semiconductor package and a method of manufacturing the semiconductor package. Background technique [0002] At present, in semiconductor packages, the coefficient of thermal expansion (Coefficient of Thermal Expansion, CTE) of each component in the semiconductor package is different, which will cause the semiconductor package to warp, and then affect the subsequent mounting process of the substrate. and cutting process. For example, when a semiconductor chip is encapsulated on a substrate with an encapsulation material such as epoxy resin, warping of the semiconductor package may occur due to thermal expansion and contraction of the encapsulation material. [0003] figure 1 is a schematic cross-sectional view showing a semiconductor package according to the prior art, figure 2 is another schematic cross-sectional view showing a se...
Claims
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IPC IPC(8): H01L23/31H01L23/29H01L23/373H01L23/552H01L21/56
CPCH01L23/3135H01L2224/16227H01L2224/32225H01L2224/48091H01L2224/48227H01L2224/48235H01L2224/73204H01L2224/73265H01L2924/15311H01L2924/3025H01L2924/00012H01L2924/00H01L2224/16225
Inventor 马慧舒
Owner SAMSUNG SEMICON CHINA RES & DEV