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Induction-heating-based structure thermal environment simulation method and apparatus

A technology of environmental simulation and induction heating, applied in induction heating devices, induction heating, measuring devices, etc.

Active Publication Date: 2015-12-23
HARBIN INST OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, there is no corresponding report on the use of induction heating for structural performance characterization in thermal environments.

Method used

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  • Induction-heating-based structure thermal environment simulation method and apparatus
  • Induction-heating-based structure thermal environment simulation method and apparatus
  • Induction-heating-based structure thermal environment simulation method and apparatus

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Embodiment Construction

[0068] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below with reference to the accompanying drawings and preferred embodiments. However, it should be noted that many of the details listed in the specification are only for readers to have a thorough understanding of one or more aspects of the present invention, and these aspects of the present invention can be implemented even without these specific details.

[0069] The invention heats the tested structure through induction heating, which can avoid the use of complex heating devices, and can simulate different thermal environments by adjusting the magnetic field distribution and skin depth, so that the electromagnetic field of induction heating can be designed, greatly simplifying the structural heating The environment simulation method and device improve the efficiency of structural thermal environment simulation.

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Abstract

The invention discloses an induction-heating-based structure thermal environment simulation method and apparatus. The method comprises: an appearance and dimension of a copper induction coil as well as a heating current amplitude and a heating current frequency are determined according to a material, an appearance, and a dimension of a tested structure as well as a temperature gradient of a service environment; the tested structure is placed in the induction coil, and an electric signal is applied to the induction coil based on the heating current amplitude and heating current frequency; and a temperature gradient and a strain field of the tested structure under the electromagnetic field effect are collected, and safety and reliability of the tested structure are determined based on the strain field. According to the invention, the tested structure is heated based on induction heating and thus utilization of a complex heating device can be avoided. Moreover, different thermal environments can be simulated by adjusting the magnetic field distribution and the skin depth, so that the electromagnetic field based on induction heating has high designability. The thermal environment simulation method and apparatus of the structure are simplified substantially; and the thermal environment simulation efficiency of the structure is improved.

Description

technical field [0001] The invention relates to the field of structural thermal environment simulation, in particular to an induction heating-based structural thermal environment simulation method and device. Background technique [0002] Thermal structure is widely used in industry, aviation and aerospace fields. Thermal structural stress includes stress caused by external force load and thermal stress caused by thermal load. Thermal stress plays a vital role. For example, in the process of non-uniform heating of structures, due to Inconsistent thermal distribution leads to temperature gradients in the structure, which in turn generates thermal stress. When the thermal stress generated by the temperature gradient is greater than the strength of the material itself, the structure is destroyed. At this time, the thermal stress directly determines the safety and reliability of the thermal structure. Thermal structural analysis calculations are carried out under the premise of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05B6/10G01M9/00
Inventor 金华彭祖军孟松鹤曾庆轩易法军
Owner HARBIN INST OF TECH
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