Circuit board grinding board air drying processing device

Abstract

The invention discloses a circuit board grinding board air drying processing device. The circuit board grinding board air drying processing device comprises a frame (1), wherein the frame (1) is provided with a conveying device. The circuit board grinding board air drying processing device is characterized in that, taking the conveying direction of circuit boards as the front direction, the frame (1) is sequentially provided with a pickling device (2), a grinding board device (3), a flushing device (4) and an air drying device (5) from the back to the front, an inlet end of the grinding board device (3) is provided with a circuit board thickness measurement device (6), the circuit board thickness measurement device (6) comprises a thickness measurement rotation shaft (61) and a rotary encoder (62), the air drying device (5) comprises a water absorption sponge roller (51), a water extruding device and an air blowing device (52), the water extruding device comprises an arc-shaped board (53), and a front end of the arc-shaped board (53) bends inwards to form an extruding cylinder (54). The circuit board grinding board air drying processing device has advantages of simple structure, good grinding and brushing effects and high air drying efficiency.

Description

technical field [0001] The invention relates to circuit board production equipment, in particular to a circuit board grinding board air-drying treatment device. Background technique [0002] With the development of science and technology and the progress of society, circuit boards have been applied in more and more fields. In the process of making circuit boards, it is an essential process step to use a grinding machine to treat the surface of the circuit board. This step is to grind off the oxide layer on the surface of the circuit board and strengthen the copper surface and dry film. The binding force between them, but in the actual grinding process, the position of the brush wheel needs to be adjusted according to the actual thickness of the circuit board. Most grinding machines on the market require the operator to manually set the thickness. This method not only The work efficiency is low, and there is a large deviation between the set value and the actual demand value...

AI Technical Summary

Problems solved by technology

In the production process of circuit boards, it is an essential process step to use a grinding machine to treat the surface of the circuit board. This step is to grind off the oxide layer on the surface of the circuit board and strengthen the copper surface and dry film. The binding force between them, but in the actual grinding process, the position of the brush wheel needs to be adjusted according to the actual thickness of the circuit board. Most grinding machines on the market require the operator to manually set the thickness. This method not only The work efficiency is low, and there is a large deviation between the set value and the actual demand value, which in turn causes the inconvenience of production operation and the instability of product processing quality

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