How to make Segmented Gold Fingers

Abstract

The invention provides a manufacturing method of a segmented golden finger, which comprises the following steps: covering regions of a golden finger, except for a prefabricated segmented region and a to-be-gold-plated region, by adopting a first protection structure; gold-plating the prefabricated segmented region and the to-be-gold-plated region of the golden finger to form a gold-plated layer; and removing the gold-plated layer on the prefabricated segmented region. By adopting the first protection structure for covering the regions of the golden finger, except for the prefabricated segmented region and the to-be-gold-plated region, when the to-be-gold-plated region of the golden finger is gold-plated, the prefabricated segmented region can also be gold-plated, and then the gold-plated layer on the prefabricated segmented region is removed, so that in a gold-plating process, the prefabricated segmented region does not need to be covered by adopting the protection structure so as to avoid the phenomenon of gold infiltration caused by adopting the protection structure in the prior art to cover the prefabricated segmented region of the golden finger to directly obtain the segmented golden finger, and further avoid the condition of unstable performance of the golden finger caused by the phenomenon of gold infiltration.

Description

technical field [0001] The invention relates to a method for manufacturing a golden finger, in particular to a method for manufacturing a segmented golden finger. Background technique [0002] Many rectangular metal contacts are arranged in rows on the printed circuit board near the board edge, and the metal contacts are formed by plating gold on the copper surface of the printed circuit board. These metal contacts are part of the printed circuit board and are called gold fingers because they are gold-plated and shaped like fingers. Gold fingers are used for connection between printed circuit boards, capable of connecting circuits and transmitting signals. The gold-plated layer on the surface of the gold finger can improve the plug-resistance, conductivity and oxidation resistance of this part. Cheats are generally divided into equal-length cheats, graded cheats and segmented cheats. The characteristic of segmented cheats is that each complete cheat network is composed of ...

AI Technical Summary

Problems solved by technology

[0004] But, in the manufacturing method of above prior art, need to print anti-gold-plating ink or paste anti-gold-plating dry film in prefabricated section area, and rely on anti-gold-plate ink or anti-gold-plate dry film to prevent prefabricated section area from being gold-plated, and because section gold The prefabricated segmented area of ​​the finger is small, and the anti-gold-plating ink or anti-gold-plated dry film and the copper surface of the pre-fabricated segmented area are often not firmly bonded, and the phenomenon of anti-plating ink or anti-gold-plated dry film is prone to appear, making the pre-fabricated segmented area A thin and uneven gold-plated layer is plated, and then the gold-plated layer penetrates into the copper surface, resulting in different degrees of gold infiltration in the segmented area during electroplating

At the same time, due to the inconsistency in the degree of gold penetration, the problem of gold penetration cannot be completely solved when removing the auxiliary gold-plated leads in the prefabricated segmented area, thus affecting the stability of the gold finger performance

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