Method for producing goldfinger via twice electroplating

Abstract

The invention discloses a method for producing a goldfinger via twice electroplating, comprising the following steps: B, carrying out screen printing on dielectric gold oil ink on the lead part of the goldfinger; C, pasting a dry film on the line graph area of a circuit board for protection and exposing the goldfinger part; D, carrying out electronickelling processing on the goldfinger part, forming a nickel layer on the goldfinger, then electroplating flash gold and forming a flash gold layer on the nickel layer; and E, electroplating heavy gold on the goldfinger part and forming a heavy gold layer on the flash gold layer. According to the invention, the nickel layer, the flash gold layer and the heavy gold layer are successively electroplated on the goldfinger, so that the time for electroplating the goldfinger is greatly shortened, the gold leakage caused by contacting with the electroplate liquid for a long time is avoided and therefore the problem of short circuit of the goldfinger caused by gold leakage is solved. In comparison with the prior art, the method disclosed by the invention has high efficiency and short time in electroplating the heavy goldfinger, effectively improves the production efficiency and ensures the quality of the product.

Description

Technical field: [0001] The invention belongs to the technical field of manufacturing printed circuit boards, and in particular relates to a method for making golden fingers by double electroplating. Background technique: [0002] The gold finger is used for the parts of computer graphics card, memory stick, USB interface and other related equipment in contact with other substrates. It has good wear resistance and low contact resistance, and can meet the requirements of multiple insertions. It is used in printed circuit boards. During the production process, all card boards need electroplated gold fingers. [0003] At present, the process of making gold fingers on printed circuit boards is as follows: pre-process→copper sinking→board electricity→outer layer pattern transfer→graphic electroplating→alkaline etching→AOI inspection→silk screen solder mask protection gold finger guide line→gold finger window pattern ( Use a dry film to protect the lines in the non-electrical gol...

AI Technical Summary

Problems solved by technology

[0005] In view of the above problems, the object of the present invention is to provide a method for making gold fingers by two-time electroplating, so as to solve the problem of gold infiltration caused by too long electroplating time in the existing circuit board gold finger electroplating process, resulting in the appearance of gold fingers. Short circuit, problems that affect production efficiency and product quality