Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for manufacturing suspending type mold photosensitive pattern

A manufacturing method and mold technology, which is applied in the field of manufacturing photosensitive patterns of suspended molds, can solve the problems of affecting product effects, incomplete patterns, cumbersome operations, etc., and achieve the effects of saving labor costs, clear patterns and simple operations

Inactive Publication Date: 2015-12-30
杨胜国
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the original method is used, the film plate cannot be closely attached to the surface of the metal substrate, and the pattern obtained by photosensitive development is incomplete, the deformation is serious, time-consuming, and the operation is cumbersome
Seriously affect the product effect, spend a lot of labor costs, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for manufacturing suspending type mold photosensitive pattern

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] The present invention can be further understood through the examples of the present invention given below, but the protection of the present invention is not limited thereto.

[0015] refer to figure 1 Shown, the manufacturing method of suspended type mold photosensitive pattern comprises the steps:

[0016] (1) Prepare the mold 1, the film plate with the pattern and the raw materials of the photosensitive anti-corrosion ink;

[0017] (2) Spray the photosensitive anti-corrosion ink evenly on the surface layer of the mold;

[0018] (3) Then fix the four sides of the film plate with the pattern on the surface of the mold. The film plate is in a suspended state on the surface of the mold and does not need to be completely attached

[0019] (4) Move the mold under the lampshade of the printing machine, and adjust the height according to the thickness of the pattern. Then start the printing machine to work, cure the photosensitive ink on the surface of the mold through th...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method for manufacturing a film suspending type mold photosensitive pattern. The method includes the following steps that (1) a mold, a film with a pattern and a raw material of photosensitive corrosion-resistant printing ink are well prepared; (2) the photosensitive printing ink is evenly sprayed onto the surface layer of the mold; (3) after the printing ink is dried and cured, the four sides of the film with the pattern are fixed to the surface of the mold, the film is in a certain suspending state on the surface of the mold and does not need to be completely attached to the mold; (4) the mold is flatly placed under a printer lampshade, and the placing height of the mold is adjusted according to the thickness of needed stripes; then a printer is started to work, the photosensitive printing ink is cured onto the surface of the mold through printer ultraviolet lamplight, and the needed image and text are developed on the mold; (5) the method is used for mold etching, and the cured mold is etched into the complete image and text. By the adoption of the method, through the operating process of the printer, the problems existing in film suspending-state mold pattern photosensitive curing can be effectively solved, the stripes of the pattern are kept clear, the overall effect is better, and no obvious lapped seams exist.

Description

technical field [0001] The invention relates to a metal etching process, in particular to a method for manufacturing a suspended mold photosensitive pattern. Background technique [0002] Metal etching is to first spray resist photosensitive ink on the metal substrate (mainly the mold), and then use a patterned film plate to closely adhere to the surface of the metal substrate for photosensitive development. The pattern is developed and etched, and the shoe mold is etched. Plastic molds, metal molds. A key step in the pattern required for products such as drip molds. [0003] Because there are various shapes on the surface of the metal mold substrate, for example, the surface of the metal substrate is a multi-faceted arc surface, which is uneven. If the original method is used, the film plate cannot be closely attached to the surface of the metal substrate, and the pattern obtained by photosensitive development is incomplete, the deformation is serious, and the operatio...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B44C1/20B44C1/22
Inventor 杨胜国
Owner 杨胜国
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com