Electric cabinet
A power cabinet and housing technology, which is applied to electrical components, substation/distribution device housing, and substation/switchgear cooling/ventilation, etc. and other problems, to achieve the effect of improving safety, preventing equipment leakage, and simple design
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Embodiment 1
[0024] refer to Figure 1-2 As shown, a power cabinet includes a casing 1, the casing 1 includes an outer casing 2 and an inner casing 3, the outer casing 2 wraps the inner casing 3, and a A cavity 4, the cavity 4 is provided with more than one connecting mechanism 5 which is arranged adjacent to the outer shell 2 and the inner shell 3, and the inner wall of the inner shell 3 is provided with more than one through hole 12, the shell 1 The top is provided with a semiconductor refrigeration device 6 penetrating through it. The semiconductor refrigeration device 6 includes a cooling surface 14 and a heat dissipation surface 13. The cooling surface 14 is arranged inside the casing 1, and the heat dissipation surface 13 is arranged outside the casing 1. , the cooling surface 14 is provided with a heat dissipation dehumidification device 7, the bottom of the heat dissipation dehumidification device 7 is provided with a water collecting pan 8, the inside of the housing 1 is provided ...
Embodiment 2
[0038] refer to Figure 1-2 As shown, a power cabinet includes a casing 1, the casing 1 includes an outer casing 2 and an inner casing 3, the outer casing 2 wraps the inner casing 3, and a A cavity 4, the cavity 4 is provided with more than one connecting mechanism 5 which is arranged adjacent to the outer shell 2 and the inner shell 3, and the inner wall of the inner shell 3 is provided with more than one through hole 12, the shell 1 The top is provided with a semiconductor refrigeration device 6 penetrating through it. The semiconductor refrigeration device 6 includes a cooling surface 14 and a heat dissipation surface 13. The cooling surface 14 is arranged inside the casing 1, and the heat dissipation surface 13 is arranged outside the casing 1. , the cooling surface 14 is provided with a heat dissipation dehumidification device 7, the bottom of the heat dissipation dehumidification device 7 is provided with a water collecting pan 8, the inside of the housing 1 is provided ...
Embodiment 3
[0052] refer to Figure 1-2 As shown, a power cabinet includes a casing 1, the casing 1 includes an outer casing 2 and an inner casing 3, the outer casing 2 wraps the inner casing 3, and a A cavity 4, the cavity 4 is provided with more than one connecting mechanism 5 which is arranged adjacent to the outer shell 2 and the inner shell 3, and the inner wall of the inner shell 3 is provided with more than one through hole 12, the shell 1 The top is provided with a semiconductor refrigeration device 6 penetrating through it. The semiconductor refrigeration device 6 includes a cooling surface 14 and a heat dissipation surface 13. The cooling surface 14 is arranged inside the casing 1, and the heat dissipation surface 13 is arranged outside the casing 1. , the cooling surface 14 is provided with a heat dissipation dehumidification device 7, the bottom of the heat dissipation dehumidification device 7 is provided with a water collecting pan 8, the inside of the housing 1 is provided ...
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