Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A method for preventing leakage of circuit board slots

A technology for circuit boards and troughs, which is applied in chemical/electrolytic methods to remove conductive materials, printed circuits, and printed circuit manufacturing. Effect, eliminate leakage, reduce the effect of defective and defective products

Active Publication Date: 2018-01-12
VICTORY GIANT TECH HUIZHOU CO LTD
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the actual production process, there are frequent leaks due to human negligence
However, during the inspection, the leaked gong groove was not detected, and it flowed to the customer, which led to complaints and complaints from the customer and affected the company's reputation.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A method for preventing leakage of circuit board slots
  • A method for preventing leakage of circuit board slots

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Embodiment 1 A method for preventing the leakage of the gong groove of the circuit board with the gong groove width above 0.8mm

[0020] A method for preventing the leakage of gongs in the grooves of circuit boards includes the following steps:

[0021] S1. Manufacture, press and drill the inner circuit board, and the outer circuit board is electroplated to make the outer circuit board 1.

[0022] S2. Perform graphic transfer, exposure, display, and etching.

[0023] According to the distribution of the gong groove 2 of the outer circuit board, the film negative is made for pattern transfer. Use film negatives of the same size as the outer circuit board for production. When making film negatives, the gong groove area is the opaque part, and the two foolproof PAD3 in the gong groove area and the line connecting the two foolproof PADs are the transparent part. Paste a layer of dry film on the surface of the outer circuit board, and then paste the film picture to expose, develop...

Embodiment 2

[0031] Embodiment 2 A method for preventing the leakage of the gong groove of the circuit board with the gong groove width less than 0.8mm

[0032] A method for preventing the leakage of gongs in the grooves of circuit boards includes the following steps:

[0033] S1. Manufacture, press and drill the inner circuit board, and the outer circuit board is electroplated to make the outer circuit board 1.

[0034] S2. Perform graphic transfer, exposure, display, and etching.

[0035] According to the distribution of the gong groove 2 of the outer circuit board, the film negative is made for pattern transfer. Use film negatives of the same size as the outer circuit board for production. When making film negatives, the gong groove area is an opaque part. Paste a layer of dry film on the surface of the outer circuit board, and then paste the film picture to expose, develop, etch, and remove the dry film on the circuit board surface, so that the gong groove area of ​​the etched circuit board ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A method for preventing milling leakage of a milling groove of a circuit board comprises the following steps of S1, carrying out fabrication, lamination and drilling of an inner-layer circuit board, and carrying out full-board electroplating on the surface of an outer-layer circuit board; S2, carrying out pattern transferring, exposure, displaying and etching, arranging two fool-proof PADs on a milling groove region of the circuit board if the width of the milling groove in the circuit board is greater than 0.8 millimeter and leading the two fool-proof PADs to be communicated through a lead, or etching the whole milling groove region; S3, printing a solder resistant oil ink, and carrying out solder resistant windowing on the milling groove region; S4, detecting the milling groove of the circuit board; and S5, carrying out treatment on a molding surface and fabricating the circuit board. By exposing a substrate on the milling groove region, a strong contrast between the milling region and the circuit board is formed, the milling leakage on the milling groove region is easily recognized, and the milling leakage detection efficiency of the circuit board is improved, the phenomenon of milling leakage on the milling groove region of the circuit board is prevented, and the detection efficiency of the circuit board is improved.

Description

Technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a method for preventing leakage of gong grooves on circuit boards. Background technique [0002] At present, the production of outer circuit boards in the PCB circuit board manufacturing industry usually adopts the following process: drilling → slag removal / copper sinking in the hole → full board plating → image transfer → graphic plating → circuit etching → solder mask oil screen printing → text oil Silk screen → surface treatment (gold / silver / tin) → contour processing → final quality control, and finally make qualified circuit boards. For conventional circuit boards, due to their wide range of use, their appearance specifications are not uniform and their shapes are diversified. Even in the circuit board, due to the matching parts, there are more gongs of different sizes and shapes. However, in the actual production process, due to human negligence, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/06
CPCH05K3/06H05K2203/162
Inventor 王枕张亚峰李加余张晃初
Owner VICTORY GIANT TECH HUIZHOU CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com