Method for preventing milling leakage of milling groove of circuit board

A technology for circuit boards and troughs, which is applied in chemical/electrolytic methods to remove conductive materials, printed circuits, and printed circuit manufacturing. Effect, eliminate leakage, reduce the effect of defective and defective products

Active Publication Date: 2016-01-06
南通胜宏科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the actual production process, there are frequent leaks due to human negligence
However, during the inspection, the leaked gong groove

Method used

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  • Method for preventing milling leakage of milling groove of circuit board
  • Method for preventing milling leakage of milling groove of circuit board

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0019] Example 1 A method for preventing the leakage of the gong groove of the circuit board with the gong groove width over 0.8mm

[0020] A method for preventing leakage of gongs in the gong groove of a circuit board includes the following steps:

[0021] S1. Fabrication, pressing and drilling of the inner circuit board, and the outer circuit board is electroplated to make the outer circuit board 1.

[0022] S2. Perform graphic transfer, exposure, display, and etching.

[0023] According to the distribution of the gongs 2 of the outer circuit board, the film negative is made to transfer the graphics. Use film negatives of the same size as the outer circuit board for production. When making film negatives, the gong groove area is the opaque part, and the two foolproof PAD3 in the gong groove area and the line connecting the two foolproof PADs are the transparent part. Paste a layer of dry film on the surface of the outer circuit board, and then paste the film picture to expose, dev...

Example Embodiment

[0031] Embodiment 2 A method for preventing the leakage of the gong groove of the circuit board with the gong groove width less than 0.8mm

[0032] A method for preventing leakage of gongs in the gong groove of a circuit board includes the following steps:

[0033] S1. Fabrication, pressing and drilling of the inner circuit board, and the outer circuit board is electroplated to make the outer circuit board 1.

[0034] S2. Perform graphic transfer, exposure, display, and etching.

[0035] According to the distribution of the gongs 2 of the outer circuit board, the film negative is made to transfer the graphics. Use film negatives of the same size as the outer circuit board for production. When making film negatives, the gong groove area is an opaque part. Paste a layer of dry film on the surface of the outer circuit board, and then paste the film picture to expose, develop, etch, and remove the dry film on the circuit board surface, so that the gong groove area of ​​the etched circui...

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Abstract

A method for preventing milling leakage of a milling groove of a circuit board comprises the following steps of S1, carrying out fabrication, lamination and drilling of an inner-layer circuit board, and carrying out full-board electroplating on the surface of an outer-layer circuit board; S2, carrying out pattern transferring, exposure, displaying and etching, arranging two fool-proof PADs on a milling groove region of the circuit board if the width of the milling groove in the circuit board is greater than 0.8 millimeter and leading the two fool-proof PADs to be communicated through a lead, or etching the whole milling groove region; S3, printing a solder resistant oil ink, and carrying out solder resistant windowing on the milling groove region; S4, detecting the milling groove of the circuit board; and S5, carrying out treatment on a molding surface and fabricating the circuit board. By exposing a substrate on the milling groove region, a strong contrast between the milling region and the circuit board is formed, the milling leakage on the milling groove region is easily recognized, and the milling leakage detection efficiency of the circuit board is improved, the phenomenon of milling leakage on the milling groove region of the circuit board is prevented, and the detection efficiency of the circuit board is improved.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a method for preventing leakage of circuit board grooves. Background technique [0002] At present, the production of outer circuit boards in the PCB circuit board manufacturing industry usually adopts the following process: drilling → removing slag / copper sinking in holes → full board electroplating → image transfer → graphic electroplating → line etching → solder resist oil screen printing → text oil Silk screen printing → surface treatment (gold / silver / tin) → contour processing → final quality control, and finally make a qualified circuit board. For conventional circuit boards, due to their wide range of use, their appearance specifications are not uniform and their shapes are diversified. Even inside the circuit board, due to the factors of supporting parts, there are more gong grooves of different sizes and shapes. However, in the actual produc...

Claims

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Application Information

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IPC IPC(8): H05K3/06
CPCH05K3/06H05K2203/162
Inventor 王枕张亚峰李加余张晃初
Owner 南通胜宏科技有限公司
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