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Method for preventing milling leakage of milling groove of circuit board

A technology for circuit boards and troughs, which is applied in chemical/electrolytic methods to remove conductive materials, printed circuits, and printed circuit manufacturing. Effect, eliminate leakage, reduce the effect of defective and defective products

Active Publication Date: 2016-01-06
南通胜宏科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the actual production process, there are frequent leaks due to human negligence
However, during the inspection, the leaked gong groove was not detected, and it flowed to the customer, which led to complaints and complaints from the customer and affected the company's reputation.

Method used

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  • Method for preventing milling leakage of milling groove of circuit board
  • Method for preventing milling leakage of milling groove of circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Embodiment 1 A kind of method of eliminating leakage of circuit board grooves with a groove width of more than 0.8mm

[0020] A method for preventing leakage of circuit board slots, comprising the steps of:

[0021] S1. Fabrication, pressing, and drilling of the inner circuit board, and electroplating the entire surface of the outer circuit board to form the outer circuit board 1 .

[0022] S2. Perform pattern transfer, exposure, display, and etching.

[0023] According to the distribution of the grooves 2 of the outer circuit board, make a film negative for graphic transfer. Use a film negative of the same size as the outer circuit board for production. When making film negatives, the gong groove area is the opaque part, and the two fool-proof PAD3s in the gong groove area and the lines connecting the two fool-proof PADs are the light-transmitting parts. Paste a layer of dry film on the surface of the outer circuit board, and then paste a film picture for exposure, ...

Embodiment 2

[0031] Embodiment 2 A method for preventing circuit board groove leakage with a groove width less than 0.8 mm

[0032] A method for preventing leakage of circuit board slots, comprising the steps of:

[0033] S1. Fabrication, pressing, and drilling of the inner circuit board, and electroplating the entire surface of the outer circuit board to form the outer circuit board 1 .

[0034] S2. Perform pattern transfer, exposure, display, and etching.

[0035] According to the distribution of the grooves 2 of the outer circuit board, make a film negative for graphic transfer. Use a film negative of the same size as the outer circuit board for production. When making film negatives, the gong groove area is an opaque part. Paste a layer of dry film on the surface of the outer circuit board, and then paste a film picture for exposure, development, etching, and removal of the dry film on the surface of the circuit board, so that the groove area of ​​the etched circuit board surface is...

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Abstract

A method for preventing milling leakage of a milling groove of a circuit board comprises the following steps of S1, carrying out fabrication, lamination and drilling of an inner-layer circuit board, and carrying out full-board electroplating on the surface of an outer-layer circuit board; S2, carrying out pattern transferring, exposure, displaying and etching, arranging two fool-proof PADs on a milling groove region of the circuit board if the width of the milling groove in the circuit board is greater than 0.8 millimeter and leading the two fool-proof PADs to be communicated through a lead, or etching the whole milling groove region; S3, printing a solder resistant oil ink, and carrying out solder resistant windowing on the milling groove region; S4, detecting the milling groove of the circuit board; and S5, carrying out treatment on a molding surface and fabricating the circuit board. By exposing a substrate on the milling groove region, a strong contrast between the milling region and the circuit board is formed, the milling leakage on the milling groove region is easily recognized, and the milling leakage detection efficiency of the circuit board is improved, the phenomenon of milling leakage on the milling groove region of the circuit board is prevented, and the detection efficiency of the circuit board is improved.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a method for preventing leakage of circuit board grooves. Background technique [0002] At present, the production of outer circuit boards in the PCB circuit board manufacturing industry usually adopts the following process: drilling → removing slag / copper sinking in holes → full board electroplating → image transfer → graphic electroplating → line etching → solder resist oil screen printing → text oil Silk screen printing → surface treatment (gold / silver / tin) → contour processing → final quality control, and finally make a qualified circuit board. For conventional circuit boards, due to their wide range of use, their appearance specifications are not uniform and their shapes are diversified. Even inside the circuit board, due to the factors of supporting parts, there are more gong grooves of different sizes and shapes. However, in the actual produc...

Claims

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Application Information

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IPC IPC(8): H05K3/06
CPCH05K3/06H05K2203/162
Inventor 王枕张亚峰李加余张晃初
Owner 南通胜宏科技有限公司
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