A moisture-resistant phenolic molding compound

A phenolic molding compound, moisture resistance technology, used in the field of composite materials

Active Publication Date: 2017-10-17
上海欧亚合成材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a moisture-resistant phenolic molding compound with easy-to-obtain, easy-to-process and low-cost raw materials for the problems existing in the existing general-purpose phenolic molding compound.

Method used

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  • A moisture-resistant phenolic molding compound
  • A moisture-resistant phenolic molding compound
  • A moisture-resistant phenolic molding compound

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Embodiment Construction

[0017] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention will be further elaborated below.

[0018] The manufacturing method of the molding material of the present invention can adopt the traditional twin-roller kneading method, and also can adopt the screw extrusion method.

[0019] Before kneading or extrusion, resin binders including cardanol modified thermoplastic phenolic resin and melamine resin, urotropine curing agent and curing accelerator are superfinely pulverized in advance, and the fineness reaches more than 200 mesh, and then the The above mixture is uniformly mixed with other raw materials, heated and kneaded or extruded, and finally granulated to obtain the desired product.

[0020] Below just illustrate the present invention:

[0021] The formulation materials shown in Table 1 are pulverized, mixed and kneaded or extruded according to the aforementioned m...

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PUM

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Abstract

The invention discloses a moisture-resistant phenolic molding compound, which is composed of cardanol-modified thermoplastic phenolic resin, solid melamine resin, hydrophobic cellulose, active mineral filler, urotropine curing agent, curing accelerator and mold release agent . The material has better moisture and heat resistance. The phenolic molding compound uses cardanol-modified thermoplastic phenolic resin and solid melamine resin as binder, hydrophobic cellulose and active mineral powder as filler, hexamethamine as curing agent, and a curing accelerator to make the material It has better moisture resistance than general-purpose phenolic molding compound, and the production process is simple, and the manufacturing cost is relatively low.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a moisture-resistant phenolic molding compound. Background technique [0002] Phenolic molding compound is one of the three thermosetting plastics. Due to its low cost and wide range of uses, it is especially suitable for household appliances, electrical accessories, and mechanical accessories. General-purpose phenolic molding compound is generally made of phenolic resin as binder, wood powder and mineral as filler, plus curing agent and accelerator. However, due to the hygroscopicity of phenolic resin, wood powder, and minerals, phenolic molded plastic parts have strong hygroscopic properties, causing deformation, warping, and electrical performance degradation of the material during use. Therefore, related technologies at home and abroad A lot of work has been done to improve the hygroscopicity of the material. [0003] For example, the Japanese patent No. JP20110...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/14C08L61/28C08L1/02C08K13/02C08K3/26C08K3/34
Inventor 杨小云沐霖朱永茂
Owner 上海欧亚合成材料股份有限公司
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