Speaker module

Abstract

The present invention discloses a speaker module comprising module shells. The module shells are mutually matched to form an inner cavity with a containing space. A speaker module is contained in the inner cavity and comprises a diaphragm which separates the inner cavity of the speaker module into a front cavity and a back cavity. The front cavity communicates with the external space. The inner cavity is internally provided with a heat radiator which comprises a heat conduction part and a heat radiation part. The heat conduction part is contacted with the speaker module. The heat radiation part extends to the front cavity and the back cavity at the same time. According to the speaker module, heat radiation is carried out through convection in the front cavity, the heat radiation is carried out through radiation in the back cavity, the heat radiation efficiency is high, and the heat radiation effect is good.

Description

technical field [0001] The invention relates to the field of electroacoustics, in particular to a loudspeaker module. Background technique [0002] Micro-speakers are an indispensable part of modern mobile electronic devices, and they are the most basic sound-generating units. Along with the upgrading of electronic products and the continuous progress of science and technology, people have put forward higher and higher requirements for the performance of micro speakers. In order to improve the sensitivity of the speaker and increase the volume of the speaker, the rated operating power of the existing speaker module is increasing, which also causes the speaker to generate more and more heat during operation. Especially when using a speaker module driven by an intelligent power amplifier, the speaker product will generate more heat. However, due to the small structure of the speaker module itself and the relatively complicated internal structure, there is often a problem of ...

AI Technical Summary

Problems solved by technology

However, due to the small structure of the speaker module itself and the relatively complicated internal structure, there is often a problem of poor heat dissipation.

When the heat accumulated inside the loudspeaker is too high, it is easy to have adverse effects on the diaphragm, magnetic circuit system and other components, such as causing changes in the elasticity of the diaphragm, demagnetization of the magnetic circuit system, etc., resulting in performance degradation of the speaker product, noise or even disconnection. line etc.

[0003] The patent application number is CN201520390517.6 discloses a speaker module structure, the front cavity is provided with a heat dissipation structure capable of dissipating heat, which can reduce the accumulation of heat inside the speaker to a certain extent, however, the speaker module disclosed in this patent , the heat dissipation structure is only set in the front cavity of the module, and the air is exchanged between the sound outlet of the front cavity and the external environment, and the heat dissipation is realized in the form of convection, but the heat accumulated in the rear cavity of the module is not effective. Export, there are still some limitations

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