Cutting fluid circulation device for silicon wafer cutting machine
A technology of circulation device and cutting machine, which is applied in work accessories, stone processing equipment, manufacturing tools, etc., can solve problems such as accumulation of large foam and silicon wafer damage, and achieve the effect of improving stability and optimizing quality.
Active Publication Date: 2017-01-25
谢冰
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Problems solved by technology
[0004] The invention provides a cutting fluid circulation device for a silicon wafer cutting machine, which aims to overcome the problem that the cutting fluid circulation system used for a silicon wafer cutting machine in the prior art tends to accumulate a large amount of foam in the pipeline, which easily causes the lack of damage
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[0014] A cutting fluid circulation device for a silicon wafer cutting machine according to the present invention will be further described below in conjunction with the accompanying drawings. Such as figure 1 , figure 2 As shown, a cutting fluid circulation device for a silicon wafer cutting machine includes a water storage tank 1, the water storage tank 1 supplies water to at least one cutting machine through a water supply pipe 2, and two water supply pumps 14 are connected to the water storage tank 1 , after the two water supply pumps 14 are connected in parallel, they both supply water to the water supply pipe 2, that is to say, the two water supply pumps 14 are used in parallel, and both water supply pumps 14 can be pneumatic diaphragm pumps, and one water supply pump 14 can be used as the other during maintenance. The standby machine of water supply pump 14 is used;
[0015] The cutting machine includes a water tank 3, the water supply pipe 2 communicates with the wat...
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The invention relates to a cutting fluid circulation device used for a silicon wafer sawing machine, which solves the defect of a cutting fluid circulation device used for the silicon wafer sawing machine in the prior art that a large amount of foam is easily accumulated in a pipeline, so that a silicon wafer can be easily damaged during sawing. According to the cutting fluid circulation device used for the silicon wafer sawing machine provided by the invention, a water storage bucket is connected with a water supplying pump; the water supplying pump supplies the cutting fluid into a water tank of the sawing machine through a water supplying pipe; the cutting fluid which is used in sawing in the water tank flows into an overflow pipe through an overflow port; a defoaming pool is connected with the overflow pipe in series; a water inlet and a water outlet are formed in the defoaming pool, and the horizontal height of the water inlet is higher than the horizontal height of the water outlet; a safety valve is arranged in the water outlet; and the cutting fluid discharged from the water outlet is subjected to precipitation, filter and reprecipitation, and then enters the water storage bucket for circular use.
Description
technical field [0001] The invention relates to a cutting fluid circulation device for a silicon wafer cutting machine. Background technique [0002] Silicon wafer cutting machine is a necessary equipment for the production of silicon wafers, which plays the role of cutting silicon ingots. That is to say, silicon ingots are cut by a cutting machine to form silicon wafers. Therefore, a cutting machine must be used to produce silicon wafers. Due to the particularity of silicon ingots, when the cutting machine cuts silicon ingots, the cutting fluid will generate a lot of foam. In order to ensure the normal operation of the cutting machine, a large amount of water has to be added to ensure the normal operation of the cutting machine. [0003] The cutting fluid circulation system of the cutting machine in the prior art generally supplies water to several cutting machines uniformly from one water supply pipe, and then the cutting fluid after participating in the cutting is recove...
Claims
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IPC IPC(8): B28D7/02
Inventor 陈小力刘佳
Owner 谢冰