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Stripping device and stripping method of laminated body, and manufacturing method of electronic device

A peeling device and laminated body technology, which is applied in the fields of printed circuit manufacturing, electrical components, photovoltaic power generation, etc., can solve the problems of substrate handling deterioration, etc., and achieve the effects of shortening non-operating time, easy replacement, and easy exchange

Active Publication Date: 2018-07-31
ASAHI GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, if the thickness of the substrate becomes thinner, the handleability of the substrate deteriorates, so it is difficult to form functional layers for electronic devices (thin film transistor (TFT: Thin Film Transistor) and color filter (CF: ColorFilter)) on the surface of the substrate

Method used

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  • Stripping device and stripping method of laminated body, and manufacturing method of electronic device
  • Stripping device and stripping method of laminated body, and manufacturing method of electronic device
  • Stripping device and stripping method of laminated body, and manufacturing method of electronic device

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Embodiment Construction

[0038] Embodiments of the present invention will be described below with reference to the drawings.

[0039] Hereinafter, the case where the peeling apparatus and peeling method of the laminated body of this invention are used in the manufacturing process of an electronic device is demonstrated.

[0040] Electronic devices refer to electronic components such as display panels, solar cells, and thin-film secondary batteries. Examples of the display panel include a liquid crystal display (LCD: Liquid Crystal Display) panel, a plasma display panel (PDP: Plasma Display Panel), and an organic EL display (OELD: Organic Electro Luminescence Display) panel.

[0041] Manufacturing process of electronic devices

[0042] Electronic devices are produced by forming functional layers for electronic devices (thin-film transistors (TFTs) and color filters (CFs) in the case of LCDs) on surfaces of substrates made of glass, resin, or metal.

[0043] Before forming a functional layer, the ba...

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Abstract

The present invention provides a peeling device and peeling method of a laminated body and a manufacturing method of an electronic device. The peeling device of the above-mentioned laminated body is for the laminated body in which the first substrate and the second substrate are attached in a detachable manner, along the direction from one end side to the other end side at the interface between the first substrate and the second substrate. Peeling is carried out sequentially in the direction of peeling progress, including: a support part, which supports the above-mentioned first substrate of the above-mentioned laminate; a peeling unit, which includes an adsorption part and a plate-shaped first flexible member, and the adsorption part is provided on The first flexible member for sucking the second substrate of the laminate; and a drive unit for deforming the peeling unit so that the second substrate of the laminate sequentially bends from one end side toward the other end side out of shape.

Description

technical field [0001] The present invention relates to a peeling device and a peeling method of a laminate, and a method of manufacturing an electronic device. Background technique [0002] With thinner and lighter electronic devices such as display panels, solar cells, and thin-film secondary batteries, thinner substrates (first substrates) such as glass plates, resin plates, and metal plates used in these electronic devices are expected. [0003] However, if the thickness of the substrate becomes thinner, the handleability of the substrate deteriorates, so it is difficult to form functional layers for electronic devices (thin film transistor (TFT: Thin Film Transistor) and color filter (CF: ColorFilter)) on the surface of the substrate . [0004] Therefore, a method of manufacturing an electronic device has been proposed in which a glass reinforcing plate (second substrate) is attached to the back surface of the substrate to form a laminate in which the substrate is rein...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65H41/00H05K3/00
CPCY02E10/50
Inventor 伊藤泰则宇津木洋滝内圭
Owner ASAHI GLASS CO LTD