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Temperature control structure

A technology of temperature control and heat dissipation structure, applied in the direction of temperature control, non-electric variable control, control/regulation system, etc., can solve the problem of poor temperature control accuracy, and achieve the effect of ensuring accurate and high-precision temperature control

Active Publication Date: 2016-01-27
SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Traditional temperature control devices use air-cooled or liquid-cooled devices, and the temperature control accuracy is poor

Method used

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Embodiment Construction

[0020] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0021] Any feature disclosed in this specification (including the abstract and drawings), unless specifically stated, can be replaced by other equivalent or similar purpose alternative features. That is, unless expressly stated otherwise, each feature is one example only of a series of equivalent or similar features.

[0022] Such as figure 1 and figure 2 The temperature control structure shown includes a heat dissipation structure, a temperature control execution unit and a temperature detection unit; the temperature control execution unit includes a semiconductor cooling chip 7; the temperatur...

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Abstract

Provided in the invention is a temperature control structure comprising a heat radiation structure, a temperature control execution unit and a temperature detection unit. The temperature control execution unit includes a semiconductor refrigeration plate; and the temperature detection unit includes a thermistor. The temperature control structure is characterized in that the lower surface of the semiconductor refrigeration plate is a thermal surface and is in conduction contact with the heat radiation structure; and the upper surface of the semiconductor refrigeration plate is a cold surface and is in conduction contact with a temperature controlled element. And thermal transmission between the semiconductor refrigeration plate and the thermistor is realized by an aluminium nitride circuit wafer. Under the circumstance that compatibility of the semiconductor refrigeration plate and the thermistor is guaranteed, accuracy of temperature detection of the semiconductor refrigeration plate by the thermistor is guaranteed, thereby guaranteeing high-precision temperature control.

Description

technical field [0001] The invention relates to a temperature control structure, in particular to a temperature control structure suitable for the technical field of heat dissipation of electronic equipment. Background technique [0002] Temperature changes have a great influence on the performance parameters of some optical devices, especially photonic filters and light sources. In microwave photonics applications, it is important to consider temperature control measures for optical devices. Generally, there are two ways to eliminate the influence of temperature changes on the performance of optical devices: one is to establish the corresponding relationship between device performance and temperature, and to compensate through models; the other is to eliminate the influence of temperature changes through temperature control structures, so that the devices are always Work at a fixed temperature. [0003] Traditional temperature control devices use air-cooled or liquid-cool...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G05D23/24
Inventor 赵俊杰廖长江练平吴立丰
Owner SOUTHWEST CHINA RES INST OF ELECTRONICS EQUIP
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