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Central base for integrated two-axis lift and spin motor in multi-wafer turntable ald

A technology for motors and motor casings, applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc., can solve problems such as damage, expensive, difficult to use chips, etc.

Active Publication Date: 2020-10-30
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Additional hardware can be expensive, difficult to install, difficult to use and / or cause damage to the die during use

Method used

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  • Central base for integrated two-axis lift and spin motor in multi-wafer turntable ald
  • Central base for integrated two-axis lift and spin motor in multi-wafer turntable ald
  • Central base for integrated two-axis lift and spin motor in multi-wafer turntable ald

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Embodiment Construction

[0020] Embodiments of the present application provide methods and apparatus capable of holding wafers in place during processing to prevent or minimize accidental damage to wafers and hardware. Embodiments of the present case are directed to apparatus and methods for generating a pressure differential resulting from a unique precursor injector design of a magnitude sufficient to hold a wafer in place at high rotational speeds. As described in this specification and the appended claims, the terms "wafer", "substrate" and the like are used interchangeably. In some embodiments, a wafer is a rigid, discrete substrate.

[0021] In some spatial ALD chambers, the precursors for deposition are implanted very close to the wafer surface. In order to create aerodynamics, the injector channel is independently controlled at a higher pressure than the surrounding chamber. By creating a pressure differential between the front side of the wafer and the back side of the wafer, a positive pre...

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PUM

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Abstract

Disclosed are an apparatus and methods for processing a semiconductor wafer including a two-axis lift-rotation motor center pedestal with vacuum capabilities. Wafers receives a pressure differential between the top surface and bottom surface so that a sufficient force prevents the wafer from moving during processing, wherein the pressure differential is generated by applying decreased pressure to the back side of the wafer through interface with the motor assembly.

Description

technical field [0001] Embodiments of the present invention generally relate to apparatus and methods for holding substrates during processing. In particular, embodiments of the present application are directed to apparatus and methods that use differential pressure to hold a substrate on a susceptor under large acceleration forces. Background technique [0002] In some CVD and ALD processing chambers, a substrate, also referred to herein as a wafer, moves relative to a precursor injector and / or heater assembly. If the motion produces an acceleration force greater than the frictional force, the wafer may become displaced, causing damage or related problems. Wafers placed off-axis can slide with high acceleration / deceleration on a moving / rotating susceptor. Friction from the wafer's own weight may not be sufficient to hold the wafer on a tool seeking higher throughput. [0003] To prevent rotational forces from moving the wafer during processing, additional hardware may be...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/205H01L21/20H01L21/68
CPCH01L21/02104H01L21/68H01L21/02H01L21/67011H01L21/6835
Inventor J·约德伏斯基K·甘加基德加
Owner APPLIED MATERIALS INC