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Molded sensor package with integrated magnet and method of manufacturing same

A sensor, sensor tube technology, applied in the direction of magnetic sensor housing, electromagnetic device manufacturing/processing, single-device manufacturing, etc., can solve problems such as high production cost, magnet size and magnetic field limitations, low electrical accuracy, etc.

Active Publication Date: 2018-02-23
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Overmolding requires relatively high Tg (glass transition temperature) molding compounds, such as Tg>180 o C, resulting in significant thermal stress on the sensor package
Due to the imprecise placement of the magnets, such sensor packages have low electrical accuracy, requiring the sensor die to have otherwise large tolerances
Also, overall packaging costs increase due to higher production costs associated with processing individual magnets plus pole pieces in series
Furthermore, with this approach, the size of the magnet and the magnetic field are limited

Method used

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  • Molded sensor package with integrated magnet and method of manufacturing same
  • Molded sensor package with integrated magnet and method of manufacturing same
  • Molded sensor package with integrated magnet and method of manufacturing same

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Embodiment Construction

[0014] Embodiments described herein provide a sensor package comprising a magnet and a sensor die molded with the same molding compound, which is fabricated via a single molding process. Single molding process includes: loading the magnet and lead frame with sensor die into the molding tool so that the magnet and sensor die are aligned; when loaded in the molding tool, molding the magnet and sensor with the same molding compound a die; and curing a molding compound so that the magnet is attached to the lead frame by the same molding compound surrounding the sensor die. The resulting molded sensor package includes a lead frame with the sensor die, a magnet aligned with the sensor die, and a single molding compound that surrounds the sensor die and attaches the magnet to the lead frame.

[0015] Figure 1, including Figures 1A-1E , illustrating an embodiment of a method for making a single molding process of a molded sensor package with magnets.

[0016] exist Figure 1A , the...

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Abstract

The present invention relates to molded sensor packages with integrated magnets and methods of manufacturing the same. The molded sensor package includes: a lead frame with a sensor die attached to the lead frame; a magnet aligned with the sensor die; and a single molding compound surrounding the sensor die and attaching the magnet to the lead frame. A method of manufacturing a molded sensor package comprising: loading a magnet and a lead frame into a molding tool so that the magnet aligns with the sensor die in the molding tool; molding with the same molding compound as loaded in the molding tool the magnet and the sensor die; and curing the molding compound so that the magnet is attached to the lead frame by the same molding compound surrounding the sensor die.

Description

technical field [0001] This application relates to sensor packages, in particular to molded sensor packages with magnets. Background technique [0002] Some types of sensors such as Hall sensors and camshaft sensors require magnets for proper operation. These sensors are typically fabricated as a semiconductor die that is attached to a lead frame and embedded in a molding compound to form a sensor package. [0003] In some cases, the magnet is overmolded into the sensor package. Overmolding is a technique that allows a previously molded part to be reinserted into the mold to form a new layer of plastic around the first part. Overmolding a magnet to a plastic sensor package typically involves melting a pellet of magnetized material and injecting the molten material into a mold containing the plastic package. The magnets are realized from cured molding compound. That is, there are no physically separated magnets. Instead, the magnets are formed from the overmolded plastic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L43/04H01L43/14H10N52/01H10N52/80
CPCH10N52/80H10N52/01H01L2924/181H01L2224/48091G01R33/0047G01R33/0052H01L2924/00012H01L2924/00014
Inventor K.埃利安M.H.H.莫德塔希尔C.T.黄戴秋婷
Owner INFINEON TECH AG