Simplified Algorithm for Bending Deformation of Cantilever Thin Plate

Abstract

The invention provides a simplified algorithm for the bending deformation of a cantilever thin plate under force, which can use a frame model composed of five beams to replace the cantilever thin plate, and complete the approximation of the cantilever thin plate by adjusting the stiffness of the five beams. Then get the empirical formula K corresponding to the stiffness of each beam and the position of any concentrated force Ff; when it is necessary to calculate the bending deformation of any point on the cantilever thin plate under the action of the concentrated force Ff, substitute the coordinates of the point into the obtained empirical formula K, to obtain the stiffness of each beam, and then calculate the bending deformation of the point, that is, to obtain the bending deformation of the point on the cantilever thin plate under the action of the concentrated force Ff; within the allowable range of engineering errors, compared with the traditional Finite element simulation, direct measurement, or direct solution with elastic mechanics theory, using the simplified algorithm of cantilever thin plate bending deformation under force, saves calculation time, thereby making timely deformation compensation during thin plate processing, and improving processing efficiency and quality.

Description

technical field [0001] The invention relates to the processing field of cantilever thin plates, in particular to a simplified algorithm for bending deformation of cantilever thin plates under force. Background technique [0002] In the modern digital manufacturing and assembly industry, the main connection method of parts is mechanical connection. In the assembly process, there will be a large number of bolts, rivets and other connections of laminate materials. Therefore, hole-making processing of laminate materials is still very common. and a very important process. In laminated hole making, it is often necessary to use one tool to complete the hole processing of two or more different materials at one time. Under the dual action of pressing force and drilling force during processing, the laminated board will be bent and deformed, resulting in a gap between the two layers, resulting in the inclination of the processed hole and so on. Improving the quality of hole-making de...

AI Technical Summary

Problems solved by technology

Under the dual action of pressing force and drilling force during processing, the laminated board will be bent and deformed, resulting in a gap between the two layers, resulting in the inclination of the processed hole, etc.

Improving the quality of hole-making depends on the research on the bending deformation of thin plates. However, the traditional calculation algorithm for calculating the bending deformation of thin plates under concentrated force is very complicated, the calculation is large and time-consuming, and it is difficult to make timely deformation compensation during the hole-making process of thin plates.

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