Twice-molded type reversible-plug USB connector and manufacturing method thereof

Abstract

A twice-molded type reversible-plug USB connector comprises a first terminal unit, an isolation middle plate, a first insulator which is formed by injection molding and is superposed on the first terminal unit and the isolation middle plate in a spacing manner in a vertical direction, a second terminal unit installed on one side of the first insulator on the isolation middle plate, and a second insulator that enables the first insulator and the second terminal unit to be formed as a whole body through injection molding. The first insulator is provided with terminal positioning slots and spacing bosses close to one side of the isolation middle plate. The second terminal unit is positioned in the terminal positioning slots of the first insulator. Second contact parts abut against the surfaces of the spacing bosses and then undergo injection molding to form the second insulator. According to the invention, the problem that a conventional product is low in efficiency because of undergoing injection molding too frequently is effectively solved.

Description

technical field [0001] The present application relates to the field of electrical connectors, in particular to a two-time molded front and back USB connector and a manufacturing method thereof. Background technique [0002] The Universal Serial Bus (USB) widely exists in people's daily life, and most electronic equipment data transmission adopts this common standard; the emergence of the USB3.0 standard has greatly improved the data transmission speed. In terms of USB interface design, USB3.0 can perfectly implement design changes without affecting backward compatibility and structural appearance. However, in the MicroUSB field of mobile terminal applications, it is impossible to achieve functional upgrades while ensuring that the structural appearance remains unchanged. The MicroUSB3.0 standard eventually complicates the appearance structure, that is, an interface is added in a side-by-side manner to accommodate the increased functional solder pins. However, it takes up mo...

AI Technical Summary

Problems solved by technology

However, in the MicroUSB field of mobile terminal applications, it is impossible to achieve functional upgrades while ensuring that the structural appearance remains unchanged. The MicroUSB3.0 standard eventually complicates the appearance structure, that is, an interface is added in a side-by-side manner to accommodate the increased functional solder pins. However, it takes up more space and is limited to the development trend of ultra-thin smartphones, which greatly limits the application of MicroUSB3.0 on mobile phones. A new high-speed serial universal bus is urgently needed to solve this problem.

[0003] In this case, the USB Association has launched a new USB3.1 Type C interface connector, which takes into account both size and performance, and is suitable for applications on smart terminals, but it is not backward compatible

Due to the complexity of the product structure and the existence of the metal isolation middle plate and the first and second terminal groups respectively located on both sides of the metal isolation middle plate, in the current manufacturing process, the thimble of the mold cannot be fixed and positioned in the mold at the same time. The relative position of the three, that is, it is impossible to form the above three into one structure through one-time injection molding

Patent application No. 201410395693.9 of the People's Republic of China discloses a USB3.1 Type C connector, which solves the manufacturing problem of small-sized and complex structural parts by adopting the manufacturing process of upper and lower plastic parts separately formed and finally assembled. There are still some problems in the structural integrity. The upper and lower sets of conductive terminal modules need to be held together by metal parts.

Another example is the patent application No. 201510379998.5 of the People's Republic of China. In order to solve the above-mentioned problem of structural integrity, the middle plate and the two sets of conductive terminals located on the upper and lower sides of the middle plate are formed into a whole by three-time injection molding. However, the injection molding process More, it will affect the yield rate of the product, and occupy too much resources of the injection molding machine, so that the manufacturing cost of the product remains high

Images