Vacuum evaporation apparatus

An evaporation and vacuum technology, which can be used in vacuum evaporation plating, sputtering plating, ion implantation plating and other directions, which can solve problems such as large impact and reduced cycle time.

Active Publication Date: 2016-02-10
HITACHI ZOSEN CORP
View PDF4 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, when the evaporation rate is low, the evaporation of the evaporation material is promoted by increasing the temperature of the heat source, but the evaporation material deteriorates due to the product

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Vacuum evaporation apparatus
  • Vacuum evaporation apparatus
  • Vacuum evaporation apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0091] The vacuum vapor deposition apparatus according to Embodiment 1 of the present invention will be described below with reference to the drawings.

[0092] like figure 1 As shown, the vacuum evaporation device includes a container for evaporation (also referred to as a container for film formation or a vacuum chamber) 1 and a material supply device 3 . The evaporation container 1 has an evaporation chamber (also referred to as a film-forming chamber) 2, and the evaporation chamber 2 is used in a predetermined vacuum environment (for example, 10 -5 In a high vacuum environment below Pa) the vapor deposition material M is attached to the surface (lower surface) of a film-shaped substrate (specifically, a film) K as a member to be vapor deposited to form a thin film. The material supply device 3 supplies (guides) the vapor deposition material M to the vapor deposition container 1 , that is, supplies (guides) the vapor deposition material M to the vapor deposition chamber 2 ...

Embodiment 2

[0138] Next, a vacuum vapor deposition apparatus according to Example 2 of the present invention will be described with reference to the drawings.

[0139] In the above-mentioned Example 1, the vibration imparter (vibration mechanism) was used to vibrate the material filling container, but the vacuum vapor deposition apparatus of this Example 2 agitates the inside of the material filling container instead of vibration.

[0140] Because the different parts of the vacuum evaporation device of the present embodiment 2 and the embodiment 1 are the parts of the material filling container, the present embodiment 2 focuses on this part, and the same reference numerals are attached to the same components as the embodiment 1 and A detailed description thereof is omitted.

[0141] Briefly, in the material moving path changing pipe 61 described in the first embodiment, a stirring device (stirring mechanism) capable of stirring the vapor deposition material in the material filling contain...

Embodiment 3

[0163] Hereinafter, the vacuum evaporation apparatus of Example 3 of the present invention will be described with reference to the drawings.

[0164] like Figure 9 As shown, the present vacuum evaporation device includes a container for evaporation (also referred to as a container for film formation or a vacuum chamber) 101 and a material supply device 103 . The evaporation container 101 has an evaporation chamber (also referred to as a film forming chamber) 102, and the evaporation chamber 102 is used in a predetermined vacuum environment (for example, 10 -5 In a high vacuum environment below Pa) the vapor deposition material M is attached to the surface (lower surface) of a film-shaped substrate (specifically, a film) K as a member to be vapor deposited to form a thin film. The material supply device 103 supplies (guides) the vapor deposition material M to the vapor deposition container 101 , that is, the vapor deposition chamber 102 .

[0165] First, the internal structu...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

This invention provides a vacuum evaporation apparatus. A material supplier (3) supplies evaporation material to an evaporation container (1) for forming a thin film on a substrate (K). The material supplier (3) comprises: a material filling container (11) filled with an evaporation material; a material guide channel (12) for guiding the evaporation material from the material filling container (11) toward the evaporation container (1) by using inertia gas supplied by a gas supplier (14); a heater (17) for heating the material guide channel (12) to gasify the evaporation material; and a vibration provider (13) for providing vibration to the material filling container (11).

Description

technical field [0001] The present invention relates to a vacuum vapor deposition apparatus for forming a thin film of a metal material, an organic material, or the like on a member to be vapor deposited such as a substrate. Background technique [0002] Usually, when forming a thin film on the surface of a substrate, a vacuum vapor deposition apparatus is used. The vacuum evaporation device puts the evaporation material into a container such as a crucible, heats it with a heat source arranged on the container to evaporate the material, and makes the evaporated material adhere to the substrate arranged on the upper part of the film forming chamber s surface. In addition, it is necessary to control the vapor deposition rate on the substrate surface to be constant. Based on the vapor deposition rate obtained by the thickness of the film formed on the substrate surface detected by the film thickness sensor, the vapor deposition rate is controlled by controlling the heater inst...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C23C14/24
Inventor 金信真理子藤本英志大工博之松本祐司千住直辉
Owner HITACHI ZOSEN CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap