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A placement machine

A placement machine and placement head technology, which is applied in the direction of assembling printed circuits with electrical components, can solve the problem of low placement efficiency of placement machines

Active Publication Date: 2018-10-12
SHANGHAI RUKING ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a placement machine for solving the problem of the placement of multiple electronic components regularly arranged on the PCB in the prior art, and the placement of a single suction nozzle. The problem of low machine placement efficiency

Method used

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Examples

Experimental program
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Embodiment 1

[0048] This embodiment discloses a placement machine, specifically as figure 1 As shown, it includes a support frame 100, a placement head 200, a conveying device 300, a feeding device 400 and a control device. The control unit is not shown in the accompanying drawings.

[0049] The placement head 200 is movably installed on the support frame 100 ; the placement head 200 can move left and right along the Y direction and up and down along the Z direction along the support frame 100 . X direction, Y direction and Z direction such as figure 1 direction shown. The placement head 200 includes a nozzle base 210, a pneumatic control device and a plurality of nozzles 220, such as figure 2 As shown, the pneumatic control device is not marked in the drawings.

[0050] A plurality of suction nozzles 220 are installed on the nozzle base 210, and the plurality of suction nozzles 220 installed on the nozzle base 210 present a layout that matches the regular arrangement, such as image...

Embodiment 2

[0066] The structure of this embodiment is exactly the same as that of Embodiment 1, and also includes a support frame 100 , a placement head 200 , a conveying device 300 and a feeding device 400 . But in this example, if Figure 12 As shown, the position of the feeding device 400 is different from that of Embodiment 1. The feeding device 400 is located directly below the conveying device 300 , corresponding to the placement head 200 .

[0067]The purpose of changing the position of the feeding device 400 is to reduce the movement of the placement head 200 and increase the placement accuracy of the placement head 200 . Since the feeding device 400 is located at a position corresponding to the placement head 200, the placement head 200 only needs to move up and down on the support frame 100 along the Z direction when picking up electronic components. The less the movement of the placement head 200 is, the easier the positioning between the placement head 200 and the PCB board ...

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PUM

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Abstract

The invention provides a chip mounter. A number of electronic components are surface-mounted on a PCB. A number of electronic components are regularly arranged on the PCB. A number of electronic components are arranged in a column or a number of columns, and the electronic components in each column are the same. The chip mounter comprises a support frame, a surface-mounting head, a conveyor, a feeding device and a control device. The surface-mounting head is movably arranged on the support frame, and comprises a nozzle base, a pneumatic control device and a number of nozzles. A number of nozzles are arranged on the nozzle base according to layout consistent with the regular arrangement. The pneumatic control device is connected with a number of nozzles. The conveyor conveys the PCB in X direction. The feeding device provides a number of electronic components for the surface-mounting head at the same time according to the regular arrangement. The control device is used for controlling the operation of the surface-mounting head, the conveyor and the feeding device. The chip mounter provided by the invention is suitable for carrying out mass surface-mounting on the electronic components which are regularly arranged on the PCB, and has the advantages of low production cost, compact structure, fast surface-mounting and high precision.

Description

technical field [0001] The invention relates to the technical field of electronic mounting, in particular to a placement machine for simultaneously mounting multiple electronic components on a PCB. Background technique [0002] The placement machine is an important equipment in the SMT (Surface Mount Technology, Surface Mount Technology) assembly line, and it is also the most costly and demanding piece of equipment in the SMT production line. With the development of the electronics industry, the mounting requirements for PCB (Printed Circuit Board, printed circuit board) in the SMT process are getting higher and higher, and the requirements for placement machines are also getting higher and higher, not only high speed and high efficiency; But also requires a high placement accuracy. The efficiency of the placement machine determines the efficiency of the entire production line. [0003] Existing placement machines can be roughly divided into three types from the structure:...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/30
Inventor 管洪飞熊德华
Owner SHANGHAI RUKING ELECTRONICS