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Single-wafer bearing chamber structure

A single-wafer, carrier-cavity technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as door opening timeout and sticking, and achieve the effect of improving yield

Active Publication Date: 2016-02-17
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of this, the present invention proposes a single-wafer loading chamber structure to solve the problem that the above-mentioned single-wafer loading chamber door is closed for a long time, and the components on the single-wafer loading chamber door are stuck by the rubber ring on the sliding guide rail, resulting in Door open timeout problem

Method used

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  • Single-wafer bearing chamber structure

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Embodiment

[0019] See figure 1 As shown, a single wafer carrying chamber structure of the present invention includes a single wafer carrying chamber 8, a carrying chamber door 1, a clamp cylinder, a switch cylinder 4 and a guide rail 6, wherein the carrying chamber door 1 is installed on the single wafer Round the outer surface of the load-bearing chamber 8, the clamp cylinder is installed on the load-bearing chamber door 1, the load-bearing chamber door 1 realizes the sealing and ventilation of the single-wafer load-bearing chamber 8 through the clamp cylinder, and the switch cylinder 4 is installed longitudinally on the load-bearing chamber door 1 The lower part of the lower part is used to open or close the door 1 of the loading chamber. The guide rails 6 are installed on the left and right ends of the single wafer loading chamber 8. The upper and lower ends of each guide rail 6 are equipped with Teflon rings 7, Teflon rings 7 Used to reduce the pressure and friction generated when th...

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PUM

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Abstract

The invention discloses a single-wafer bearing chamber structure. A bearing chamber door is installed at the outer surface of the single-wafer bearing chamber; clamp cylinders are installed on the bearing chamber door; and with the clamp cylinders, sealing or air ventilation of the single-wafer bearing chamber by the bearing chamber door is realized. A switch cylinder is installed at the bottom of the bearing chamber door longitudinally and is used for opening or closing the bearing chamber door. Magnetic induction sensors are installed at one side of the single-wafer bearing chamber; guide rails are installed at the left end and the right end of the single-wafer bearing chamber; Teflon rings are installed at the upper ends and the lower ends of the guide rails and are used for reducing pressures and friction forces while the bearing chamber door is opened or closed. According to the invention, because the Teflons are used as materials for manufacturing rubber rings, an overtime door opening fault due to adhesiveness can be eliminated permanently; the normal operation time of the machine is improved and the manpower is saved; a problem caused by rubber ring wearing and aging can be solved; and a yield of the silicon wafer can be enhanced.

Description

technical field [0001] The invention relates to the field of semiconductor integrated circuit manufacturing, in particular to a single wafer carrying chamber structure. Background technique [0002] If the machine does not run, and the single wafer loading door (SWLLDoor) is closed for more than 3 hours, when the product wafer is ready to enter the single wafer loading room (SWLL), the single wafer loading room door opening timeout will occur (SWLLDoorOpenTimeout) failure. First of all, since the single wafer loading chamber door (SWLLDoor) is outside the atmospheric environment, the product wafer will stay in the atmospheric environment when encountering this failure, increasing the probability of being affected by particles (Particles), thereby affecting the product yield, and even causing the failure of the product wafer. Scrapping; secondly, this fault causes the machine to stop, because this problem will occur during the interval of machine running, which will waste a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
Inventor 张啸刘玮徐伯山邰晓东黄晓强朱亮
Owner SHANGHAI HUALI MICROELECTRONICS CORP