BGA base plate washing device
A technology for cleaning equipment and substrates, which is applied in the direction of cleaning methods using tools, cleaning methods using liquids, cleaning methods and utensils, etc., can solve problems such as difficulty in cleaning, achieve good cleaning effects, reduce production costs, and save consumption.
Active Publication Date: 2016-02-24
SUZHOU SUNSHINE LASER & ELECTRONICS TECH CO LTD
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AI Technical Summary
Problems solved by technology
However, the obvious defect of the BGA substrate is that it is difficult to clean after assembly, and the traditional cleaning device is difficult to meet its cleaning quality requirements
Method used
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Embodiment
[0017] Embodiment: The embodiment of the present invention is illustrated by specific specific examples below. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The descriptions "below", "top", "bottom", etc. are defined in the usual sense, e.g., with reference to the definition of the direction of gravity, the direction of gravity is below, the opposite direction is above, similarly above is top Or the top, below is the bottom or the bottom, which is only for the convenience of description, but not to limit the scope of the present invention. The change or adjustment of its relative relationship should also be regarded as no substantial change in the technical content. It is the scope in which the present invention can be implemented.
[0018] See Figure 1 to Figure 3 Shown, a kind of cleaning equipment of BGA substrate comprises: the upper part is formed with a cleaning so...
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The invention discloses a BGA base plate washing device. The BGA base plate washing device comprises a cover, a preliminary washing unit, a spraying unit, a brush bristle unit and a bearing plate unit, wherein a cleanout fluid box is molded at the upper portion of the cover, a fluid accumulating box is molded at the lower portion of the cover, a fluid outlet pipe communicated with the cleanout fluid box is arranged on the bottom end face of the cleanout fluid box, and a fiber column is inserted into the outlet end of the fluid outlet pipe; the preliminary washing unit is installed under the cleanout fluid box and used for wetting the surface of a BGA base plate so as to remove vestigial soldering paste conveniently; the spraying unit is installed under the preliminary washing unit and used for washing the BGA base plate; the brush bristle unit is installed under the spraying unit and used for washing the BGA base plate; and the bearing plate unit is installed in the fluid accumulating box and used for bearing the BGA base plate. The fiberr column is connected with the preliminary washing unit, and the spraying unit is externally connected with a water pump used for providing clean water for the spraying unit. By means of the BGA base plate washing device, the vestigial soldering paste on the BGA base plate can be effectively removed, the washing effect is good, and use is convenient.
Description
Technical field: [0001] The present invention relates to the technical field of cleaning equipment, more specifically relates to a kind of equipment for BGA substrate cleaning. Background technique: [0002] BGA high-density devices are made of spherical contacts as pins in an array on the bottom of the substrate, which has the advantages of short pins, small lead inductance and capacitance; large center distance of solder joints, high assembly yield; firm pins and good coplanarity And other advantages, has been widely used in the field of ultra-high density and ultra-miniature electronic products. However, the more obvious defect of the BGA substrate is that it is difficult to clean after assembly, and the traditional cleaning device is difficult to meet the cleaning quality requirements. Invention content: [0003] The object of the present invention is to provide a cleaning device for BGA substrates aimed at the deficiencies of the prior art, which can effectively remo...
Claims
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IPC IPC(8): B08B3/02B08B1/04
CPCB08B3/02B08B1/10B08B1/12B08B1/32
Inventor 王荣沈祺舜
Owner SUZHOU SUNSHINE LASER & ELECTRONICS TECH CO LTD