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Measuring device, substrate inspection device, control method thereof, and storage medium

A measuring device and soldering technology, which is applied in the field of solder joint state, can solve problems such as the inability to prevent the decline in the accuracy of three-dimensional shape restoration

Active Publication Date: 2018-02-23
ORMON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, this method merely locates the three-dimensional shape of the solder surface recovered by the color brightness illumination method at the height obtained by the phase shift method, and cannot prevent the decrease in the glossiness of the solder surface due to the influence of flux, etc. 3D shape recovery accuracy drops

Method used

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  • Measuring device, substrate inspection device, control method thereof, and storage medium
  • Measuring device, substrate inspection device, control method thereof, and storage medium
  • Measuring device, substrate inspection device, control method thereof, and storage medium

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no. 1 approach

[0033] (Structure of board inspection device)

[0034] refer to figure 1 , the overall configuration of a substrate inspection apparatus including a measurement apparatus according to an embodiment of the present invention will be described. figure 1 It is a schematic diagram showing the hardware configuration of the substrate inspection device. The substrate inspection device 1 is preferably used for substrate appearance inspection on a surface mounting line (for example, inspection of the state of solder joints after reflow soldering, etc.).

[0035] The substrate inspection device 1 has the following main structures: a stage 10 , a measurement unit 11 , a control device 12 , an information processing device 13 , and a display device 14 . The measurement unit 11 has a camera (image sensor) 110 , an illumination device 111 , and a projection device (projector) 112 .

[0036] The stage 10 is a mechanism for holding the substrate 15 and aligning a component 150 or solder 151...

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Abstract

The present invention is a technology capable of measuring the three-dimensional shape of the solder surface with high precision regardless of the glossiness (mirror degree) of the solder surface. The measurement device has: an image acquisition unit that acquires a first image and a second image. The first image is irradiated with light of a plurality of colors at mutually different incident angles, and color information corresponding to the inclination angle appears on the surface of the solder The second image is taken under the condition that patterned light is projected, and the surface of the solder shows pattern phase information corresponding to the height of the solder; points, to obtain the reliability of the color information of the first image; the phase reliability calculation unit, for each point on the surface of the solder, to obtain the reliability of the phase information of the second image; the solder shape measurement unit, by The three-dimensional information of each point on the surface of the solder is obtained using the highly reliable information among the color information and the phase information, and the three-dimensional shape of the solder is generated.

Description

technical field [0001] The present invention relates to a technique for inspecting the state of solder joints of components mounted on a printed circuit board, and more particularly to a technique for measuring the three-dimensional shape of solder. Background technique [0002] A substrate inspection device (also referred to as "appearance inspection device") for inspecting the quality of solder joints after reflow soldering is widely used in a surface mounting line of a printed circuit board. The substrate inspection apparatus measures various indices related to the shape of the solder based on images of the substrate, and inspects the bonding state of the solder corresponding to electrodes or lands (pads) based on the measured values. At this time, since it is necessary to inspect the three-dimensional shape of the solder using an image that is two-dimensional information, various processing methods have been proposed from the prior art. [0003] Among them, a method of ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N21/95H05K13/08
CPCG01N21/95684G01N2021/95646
Inventor 藤井心平
Owner ORMON CORP