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Anti-static LED packaging structure

An LED packaging, anti-static technology, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve the problem that the base is not easy to achieve anti-static integration.

Inactive Publication Date: 2016-03-09
BRIGHT INT ZHENJIANG ELECTRICITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the base has the problem that it is not easy to realize anti-static integration

Method used

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  • Anti-static LED packaging structure

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Embodiment Construction

[0008] In order to make the content of the present invention more clearly understood, the present invention will be further described in detail below based on specific embodiments and in conjunction with the accompanying drawings.

[0009] Such as figure 1 As shown, an antistatic LED packaging structure includes an LED chip 2, a positive electrode sheet 7, a negative electrode sheet 4, a lens 3 and a heat dissipation substrate 8, the LED chip 2 is electrically connected to the positive electrode sheet 7 and the negative electrode sheet 4 respectively, and the LED chip 2 is packaged In the lens 3 , there is thermally conductive silver glue 5 between the LED chip 2 and the heat dissipation substrate 8 , the bottom surface of the heat dissipation substrate 8 is provided with an insulating layer 9 , and the bottom surface of the insulation layer 9 is provided with a silicon base layer 6 .

[0010] The outer layer of the lens 3 is covered with an anti-reflection film 1 , and the bo...

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Abstract

The invention discloses an anti-static LED packaging structure comprising an LED chip, a positive plate, a negative plate, a lens and a heat radiating substrate. The LED chip is electrically connected with the positive plate and the negative plate, and is packaged inside the lens. Heat conduction silver glue is arranged between the LED chip and the heat radiating substrate. The bottom side of the heat radiating substrate is provided with an insulating layer, and the bottom side of the insulating layer is provided with a silicon base layer. The anti-static LED packaging structure of the invention is anti-static, and has good heat radiating performance.

Description

technical field [0001] The invention relates to an antistatic LED packaging structure, which belongs to the technical field of LED packaging. Background technique [0002] At present, due to the characteristics of LED light source such as low power consumption, long life, sensitive response, and no toxic substances, this energy-saving and environmentally friendly new light source has been widely used, such as backlight, display screen, car lights and various lighting. place. However, the base has the problem that it is not easy to realize anti-static integration. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the defects of the prior art, and provide an antistatic LED packaging structure with antistatic substrate and good heat dissipation. [0004] The technical solution adopted by the present invention to solve the above-mentioned technical problems is: an antistatic LED packaging structure, including LED ch...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/58H01L33/60H01L23/60
CPCH01L33/58H01L23/60H01L33/60
Inventor 陈彬
Owner BRIGHT INT ZHENJIANG ELECTRICITY