Manufacturing method using black film to align film directly

Abstract

The invention relates to a manufacturing method using a black film to align a film directly. The method comprises the following steps that: S1, punching is carried out on a circuit board; to be specific, a circuit board after exposure, development, electroplating, and etching processes is placed on a punching machine and a plurality of pin alignment holes are punched in the periphery of the circuit board, wherein the aperture of the pin hole is between 2.05 to 2.15mm; S2, film punching is carried out; to be specific, a pin hole target ring with the aperture of 2.05 to 2.15mm is arranged at the edge of a black film and pin holes are punched by using a film punching machine; S3, pin installation is carried out; to be specific, the puncher head of the film punching machine is changed into one with the diameter of 1.95mm and pins with the diameters of 2.0mm are installed into the pin holes obtained at the step 2; and S4, the pins in the step 3 are pressed into the corresponding pin holes of the periphery of the circuit board, thereby completing pin alignment. The provided method has the following advantages: usage of yellow films can be reduced; the cost is low; and the alignment precision is high.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for directly aligning film with a black sheet. Background technique [0002] At present, most enterprises use engineering light to draw a black film (black film) and then expose it through an exposure machine, and transfer the drawn line image to a yellow film (yellow film). The line image is fully presented through an ammonia machine smoked film, which plays a role in blocking exposure. UV function. [0003] With the diversification of circuit boards, it is difficult to completely use CCD alignment exposure machine to completely replace manual alignment in the exposure operation. Currently, brown film alignment is used, and the process of duplicating brown film is prone to poor quality problems such as red spots on the film. , Labor efficiency and material consumption are more difficult to control. Cancel the brown film and directly use the bla...

AI Technical Summary

Problems solved by technology

[0003] With the diversification of circuit boards, it is difficult to completely use CCD alignment exposure machine to completely replace manual alignment in the exposure operation. Currently, brown film alignment is used, and the process of duplicating brown film is prone to poor quality problems such as red spots on the film. , labor efficiency and material consumption are more difficult to control. The brown film is canceled and the black film is directly used for alignment. The difficulty is that the black film is opaque, and the alignment accuracy cannot be guaranteed due to the influence of the viewpoint during the line and solder mask alignment.

[0004] In the production process, the amount of film used is large, the production cost of the circuit board is high, and the service life of the yellow film is short, which further increases the burden on the enterprise