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PCBA packaging machine with high thermal efficiency

A technology of high thermal efficiency and encapsulation machine, which is applied in the manufacture of printed circuits, electrical components, printed circuits, etc., can solve the problems of low thermal efficiency and difficult temperature control, and achieve the effects of high thermal efficiency, less energy loss and fast heating speed

Inactive Publication Date: 2016-03-09
NANJING UNIV OF SCI & TECH
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  • Summary
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Problems solved by technology

[0003] In view of the above-mentioned technical deficiencies, the purpose of the present invention is to provide a PCBA encapsulation machine with high thermal efficiency, so as to overcome the problems of low thermal efficiency and difficult temperature control that cannot be solved by current technology

Method used

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  • PCBA packaging machine with high thermal efficiency

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Embodiment Construction

[0020] Below in conjunction with the embodiment shown in the accompanying drawings, the present invention is described in detail as follows:

[0021] Such as figure 1 The shown high thermal efficiency PCBA encapsulation machine mainly includes an encapsulation mechanism 10, an infrared heating mechanism 20, a pressure mechanism 30 and a control system (not shown in the figure).

[0022] Wherein, packaging mechanism 10 mainly comprises lower box body 102, upper box body 106 and workbench 104, and upper box body 106 cooperates with lower box body 102, thereby can form closed environment, and workbench 104 can be in upper box body 106 and lower box body. The closed environment surrounded by the box body 102 can be lifted up and down, that is, the workbench 104 is arranged in the upper box body 106 or the lower box body 102 so as to be able to move up and down. The infrared heating mechanism 20 corresponds to the top of the installation workbench 104, and it is located in the low...

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Abstract

The invention discloses a PCBA packaging machine with high thermal efficiency, which comprises a packaging mechanism, an infrared heating mechanism, a pressure mechanism and a control system; the packaging mechanism comprises a lower box body, an upper box body matched with the lower box body and a worktable arranged in the lower box body or the upper box body and capable of lifting up and down; the infrared heating mechanism is arranged in the lower box body or the upper box body and is positioned above the worktable; the pressure mechanism is connected with the lower box body and the upper box body respectively and used for adjusting pressure in the lower box body and the upper box body; the control system is connected with the packaging mechanism, the infrared heating mechanism and the pressure mechanism respectively and used for automatically controlling the same. The PCBA packaging machine with high thermal efficiency is fast in temperature rise speed, high in production efficiency, high in thermal efficiency and capable of realizing high-quality packaging.

Description

technical field [0001] The invention belongs to the field of packaging equipment and relates to a PCBA packaging machine, in particular to a PCBA packaging machine with high thermal efficiency. Background technique [0002] Although the current PCBA (printed circuit board assembly) packaging equipment solves the problem of packaging under vacuum conditions, there are still many insurmountable problems, such as: heating efficiency: the existing heating mechanism cannot choose the corresponding heating according to the actual situation The distance leads to low heating efficiency and high heat loss; long-term heating causes the temperature of mechanical equipment to rise, which greatly shortens the service life of the packaging machine and brings a lot of inconvenience. Heating temperature control: The heat transfer process in the heating process is relatively complicated, and there is still heat loss in each process, resulting in relatively large heating hysteresis and diffic...

Claims

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Application Information

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IPC IPC(8): H05K3/28
CPCH05K3/284H05K2203/1316
Inventor 包建东朱建晓
Owner NANJING UNIV OF SCI & TECH
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