Method, device and system for evaluating fatigue life of miniature solder joint interconnection under combined stress

Abstract

The invention relates to a method, a device and a system for evaluating a fatigue life of miniature solder joint interconnection under combined stress. The method comprises preparing a solder and a minimum unit circuit board according to a device to be evaluated, assembling the solder and the minimum unit circuit board to form a minimum unit daisy chain interconnection structure through a secondary backflow method so that the miniature solder joint interconnection is formed, fixing the minimum unit daisy chain interconnection structure to an insulative hard test clamp so that stress constraint to the miniature solder joint interconnection is formed, arranging the hard test clamp in a stress test environment, acquiring electrical parameters of the minimum unit daisy chain interconnection structure and evaluating a fatigue life of miniature solder joint interconnection according to the electrical parameters. The method can effectively evaluate a fatigue life of the miniature solder joint interconnection and realize evaluation of the fatigue life of the miniature solder joint interconnections prepared from different solders thereby optimizing the miniature solder joint interconnection structure and materials. Through comparison of fatigue lives of miniature solder joint interconnections prepared from various components, the solder joint structure and materials with best effects are ensured.

Description

technical field [0001] The invention relates to the field of packaging of electronic components, in particular to a fatigue life evaluation method, device and system for micro-interconnect solder joints under comprehensive stress. Background technique [0002] High-density packaging micro-interconnection solder joints mainly play the role of mechanical support, signal transmission and heat conduction in electronic assembly technology. Ensuring that solder joints have good mechanical support and electrical connection performance is crucial to the reliability of electronic equipment. As package sizes are miniaturized, the size of micro-interconnect pads continues to decrease. The miniaturization of solder joint size leads to obvious changes in the metallurgical behavior, microstructure formation and evolution during the reflow assembly process, especially the electromigration caused by flip chip technology makes the solder joint interface reaction and microstructure evolution ...

AI Technical Summary

Problems solved by technology

The IPC-9701A detection method requires special test instruments, such as event detectors or data recorders, and will be affected by changes in micro-interconnect solder joint composition and stress levels caused by size miniaturization, and the standard deviation of daisy-chain solder joint series circuit measurements And the resistance change of the contact point of the wire will cause a misjudgment of the fatigue life of the micro-interconnect solder joint

In addition, the electrical evaluation method of fatigue life of micro-interconnection solder joints based on IPC9701A-2006 cannot effectively locate defective solder joints, which is not conducive to the design optimization of flip-chip micro-interconnection solder joint structures and materials

[0004] In summary, the existing methods for evaluating the fatigue life of micro-interconnection solder joints in electronic packaging are prone to misjudgment and cannot effectively evaluate the fatigue life of micro-interconnection solder joints

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