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A screen packaging cover, screen body and screen packaging and cutting method

A cutting method and packaging cover technology, which is applied in the manufacture of electric solid devices, semiconductor devices, semiconductor/solid devices, etc., can solve problems such as limited application range, broken lead wire failure, and lead wire damage on the surface of the substrate, so as to improve cutting efficiency Effect

Active Publication Date: 2018-02-23
GUAN YEOLIGHT TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, there are usually two ways to cut the screen: knife wheel cutting and laser cutting. Although the knife wheel cutting will not damage the lead wires, the scope of use is limited. Only straight line cutting is used to cut out regular screens. Shape; although laser cutting can be used for cutting with special shapes (such as circular, elliptical, or other irregular shapes), during the cutting process, since the cutting line often passes through the lead area of ​​the screen body, laser cutting is easy to cause damage to the leads on the surface of the substrate. leading to lead break failure

Method used

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  • A screen packaging cover, screen body and screen packaging and cutting method
  • A screen packaging cover, screen body and screen packaging and cutting method
  • A screen packaging cover, screen body and screen packaging and cutting method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] Such as figure 1 with Figure 4 As shown, the manufacturing method of the reserved lead-out positions on the package cover specifically includes: digging corresponding through holes 41 in the package cover corresponding to the lead area of ​​the organic light emitting unit in advance, and then bonding the substrate 2 and the package cover; The cutting tool cuts the screen body along the cutting line 5 of the peripheral frame of the through hole, and the lead area of ​​the organic light emitting unit 3 is led out through the through hole 41 to facilitate driving the FPC pressing.

Embodiment 2

[0039] Such as figure 2 with Figure 5 As shown, the manufacturing method of the reserved lead-out position on the package cover specifically includes: digging corresponding hollow through holes 42 in the package cover corresponding to the lead area of ​​the organic light-emitting unit in advance, and then bonding the substrate and the package cover; The cutting tool cuts the screen body along the peripheral frame of the hollow cut line; the split area 7 of the hollow through hole 42 can be removed to form a through hole, and the lead area of ​​the organic light emitting unit 3 is led out through the through hole to facilitate driving FPC pressing.

Embodiment 3

[0041] Such as image 3 with Image 6 As shown, the manufacturing method of the reserved lead-out position specifically includes: pre-cutting a pre-cut groove on the package cover corresponding to the lead area of ​​the organic light-emitting unit, and the cutting depth is 1 / 2-9 / 10 of the package cover thickness , And then bond the substrate and the package cover; cut the screen with a cutting tool along the outer frame of the pre-cut line; after the substrate is cut, the package cover part is broken off along the pre-cut line and the pre-cut groove is removed In the split 8, the lead area of ​​the organic light-emitting unit is led out through the pre-cut groove 43.

[0042] The sequence numbers of the foregoing embodiments of the present invention are only for description, and do not represent the superiority of the embodiments.

[0043] The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifica...

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Abstract

The invention discloses a screen body packaging cover, a screen body and a screen body packaging and cutting method. The screen body packaging cover includes a cover body, one or more reserved lead leading-out positions are formed on the cover body, and axes of the reserved lead leading-out positions are arranged along a direction vertical to an upper plane of the cover body; the reserved lead leading-out positions of the packaging cover are manufactured in advance; a substrate with an organic light-emitting unit is fixedly connected with the packaging cover with the manufactured reserved lead leading-out positions, so that the organic light-emitting unit is arranged in a confined space formed by the substrate and the packaging cover; and the screen body is cut, the reserved lead leading-out positions are opened, and electrode leads of the organic light-emitting unit are led out from the reserved lead leading-out positions. According to the screen body packaging cover provided by the invention, the reserved lead leading-out positions opposite to a lead area of the organic light-emitting unit are reserved on the screen body packaging cover, and when the screen body is cut by adoption of a cutter wheel or laser, the lead area of the screen body is bypassed, thereby preventing damage from being caused to the lead area, and improving cutting efficiency of laser to a special-shaped screen body.

Description

Technical field [0001] The invention relates to a screen body packaging cover, a screen body and a screen body packaging and cutting method. Background technique [0002] The screen is composed of a screen encapsulation cover, an organic light-emitting unit and a substrate. The organic light-emitting unit is located in the enclosed area formed by the encapsulation cover and the substrate. In the mass production of the screen, we need to install the entire large-size glass substrate or A plurality of organic light-emitting units are prepared on the plastic substrate and packaged by a screen encapsulation cover, and finally the prepared screen is cut to obtain a plurality of screens to improve the production efficiency of the screen. At present, there are usually two ways to cut the screen: knife wheel cutting and laser cutting. Although the knife wheel cutting will not damage the leads, the range of use is limited. Only the straight line cutting method is used to cut regular scree...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/52H01L51/56
Inventor 段炼张国辉董艳波王静吴海燕胡永岚
Owner GUAN YEOLIGHT TECH CO LTD
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