Fabrication method of gold-plated finger board

A manufacturing method and technology of finger boards, which are applied in chemical/electrolytic methods to remove conductive materials, manufacture printed circuits, and form electrical connections of printed components. The effect of spending on obsolescence problems

Active Publication Date: 2016-03-30
谢兴龙
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0002] The traditional production method is to pull some leads from the top of the gold finger to the edge of the board, as the lead wires leading to the gold finger during electroplating, and remove the leads when the gold finger is formed after plating, such as figure 1 As shown, after the traditional method is form

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  • Fabrication method of gold-plated finger board
  • Fabrication method of gold-plated finger board
  • Fabrication method of gold-plated finger board

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Embodiment Construction

[0029] The technical features of the present invention will be further described in detail below in conjunction with the accompanying drawings so that those skilled in the art can understand.

[0030] Such as figure 1 It is a traditional gold-plated finger board manufacturing method. This method will leave a small section of the secondary lead 1 on the top of the gold finger 4. When the gold finger 4 is beveled, there will be exposed copper on the top of the finger 4 and residual bumps on the secondary lead 1 resulting in a gold surface The quality of the scratching problem is not easy to control.

[0031] The present invention is a method for manufacturing a new type of gold-plated finger plate, which includes the following steps:

[0032] A1. Cutting: Cut the board to a size that meets the design requirements;

[0033] A2, paste the inner layer dry film: paste the photosensitive dry film on the board with the cut sheet as the inner layer;

[0034] A3. Inner layer graphics transfer: u...

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Abstract

The invention discloses a fabrication method of a gold-plated finger board. According to the main points of the technical scheme, the fabrication method comprises the following steps: carrying out front process treatment on a board of a circuit board; painting a green ink; pasting blue glue; plating gold fingers; carrying out laser cutting; pasting the blue glue; etching secondary leads; carrying out screen printing of characters; and the like. According to a novel fabrication method, the secondary leads in the gold plating process are put on the leads at the bottom ends of the gold fingers; the connected secondary leads are developed and exposed during exposure in a solder mask process; after the gold fingers are plated; the connected leads are eliminated through an inner layer etching liquid; and the area is covered with a character oil clot in the character process, so that the problem that the gold finger board is scratched and scraped due to lead protrusion after the gold finger board is molded and bevel edges are routed and the problem of a fabrication difficulty due to the fact that copper is exposed out of the gold surfaces of the top ends of the gold fingers after the gold finger board is molded are effectively solved.

Description

【Technical Field】 [0001] The invention relates to a manufacturing method of a gold-plated finger plate. 【Background technique】 [0002] The traditional manufacturing method is to pull out some leads from the top of the gold finger to the edge of the board, as the lead to the gold finger during electroplating, and gong the lead when the gold finger is formed after plating, such as figure 1 As shown, after this traditional method is formed, there will be a small piece of secondary lead residue on the top of the gold finger. When the golden finger is beveled, there will be copper exposed on the top of the finger and residual bumps on the secondary lead, which will cause the problem of scratching on the gold surface. The quality is not easy to control. . [0003] The present invention is made based on this situation. [Content of the invention] [0004] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a method for manufacturing a gold-pla...

Claims

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Application Information

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IPC IPC(8): H05K3/06H05K3/40
CPCH05K3/06H05K3/403H05K2203/0723
Inventor 谢兴龙
Owner 谢兴龙
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