Method of acquiring cantilever-type probe system maintenance period

A system maintenance and cantilever technology, which is applied in the parts of electrical measuring instruments, electronic circuit testing, measuring devices, etc., can solve the problems of early maintenance warning and the inability of the cantilever probe system to predict the maintenance cycle scientifically and reasonably.

Active Publication Date: 2016-04-06
SINO IC TECH
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Problems solved by technology

[0007] The purpose of the present invention is to provide a method for obtaining the maintenance period of the cantilever probe system, so as to solve the problem that the cantilever probe system in the prior art cannot scientifically and reasonably estimate the maintenance period and early warning of maintenance during use

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  • Method of acquiring cantilever-type probe system maintenance period
  • Method of acquiring cantilever-type probe system maintenance period
  • Method of acquiring cantilever-type probe system maintenance period

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Embodiment Construction

[0029] A method for obtaining the maintenance period of the cantilever probe system proposed by the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0030] Such as Figure 1-2 As shown, it is a method for obtaining the maintenance cycle of the cantilever probe system provided by the present invention, which includes the following steps:

[0031] (1) Obtain the minimum value L of the distance between the pin mark edge of the probe of the cantilever probe system on the chip and the pin edge of the chip during the wafer test process, and the set cantilever probe system needs t...

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Abstract

The invention provides a method of acquiring a cantilever-type probe system maintenance period. The method comprises the following steps of acquiring a minimum value L of a distance between a needle mark edge of a probe on a chip and a base pin edge of the chip of a cantilever-type probe system during a wafer test process and setting a distance value L0 of the needle mark edge and the base pin edge of the chip when the cantilever-type probe system needs maintenance; acquiring time T consumed when the distance between the needle mark edge and the base pin edge of the chip reduces 1micrometre during the wafer test process; according to the acquired L and T, calculating and acquiring a maintenance period T0 of the cantilever-type probe system, wherein the maintenance period T0 satisfies the following equation: T0=(L-L0)*T. By using the method of acquiring the cantilever-type probe system maintenance period, problems that the maintenance period of the cantilever-type probe system during a usage process can not be scientifically and reasonably pre-estimated, and maintenance in advance and early warning can not be performed during the wafer test process of an integrated circuit are solved.

Description

technical field [0001] The invention belongs to the field of semiconductor testing equipment maintenance, and relates to a method for obtaining the maintenance period of a cantilever probe system. Background technique [0002] The silicon wafer is mounted on the printed circuit board (PCB) after the production is completed. When the printed circuit board is produced, if a problem is found in the inspection of the PCB, an extremely complicated diagnostic process and manual analysis are required to find the problem. s reason. If it is an integrated circuit problem, it is necessary to dismantle the problematic integrated circuit and install a replacement integrated circuit. Since the packaging of large-scale integrated circuits is generally a ball grid array package, manual disassembly is almost impossible. Therefore, it is necessary to use professional tools during the disassembly process. It can be seen that if the problem is detected after the production of the printed cir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R1/067G01R31/28
CPCG01R1/06727G01R31/2887
Inventor 岳小兵牛勇叶守银叶建明顾春华
Owner SINO IC TECH
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