Semiconductor laser chip testing and fixing device and method thereof

Abstract

The invention provides a new semiconductor laser chip testing and fixing device and a method thereof, which can avoid influences on chip output features and improve the cooling effects of the chip. In the semiconductor laser chip testing and fixing device, multiple metal films arranged at intervals are arranged on the upper surface of a chip carrier platform made of an insulated thermal conductivity material, and the length direction of each metal film is parallel with the length direction of a light emitting unit cavity of a to-be-tested chip; each metal film serves as an independent P-face power supply electrode and is fixed with an independent power supply contact correspondingly; stripe-shaped vacuum adsorption holes are parallelly arranged between adjacent P-face power supply electrodes, the vacuum adsorption holes pass through the upper surface and the lower surface of the chip carrier platform, and all the vacuum adsorption holes are communicated with an inner air path hole way of a vacuum adsorption device; and an N-face power supply electrode is a complete electrode, the lower surface is flat and smooth, and the N-face power supply electrode can be completely fit with the N-face electrode of the to-be-tested chip.

Description

technical field [0001] The invention relates to a semiconductor laser chip test fixture and a method thereof. Background technique [0002] Semiconductor laser devices have the advantages of small size, light weight, and high electro-optical conversion efficiency. They are widely used as light sources and pump light sources in medical, military, and communication fields. Semiconductor laser chips usually need to be packaged to form devices before leaving the factory for use. Before semiconductor laser chip packaging, in order to improve the yield of packaging, it is necessary to conduct relevant performance tests on semiconductor laser chips, select qualified semiconductor laser chips, and eliminate unqualified chips. . In the high-power application field of semiconductor lasers, semiconductor laser chips often exist in the form of bars, and there are usually multiple light-emitting units in the bars. Whether the output characteristics of the light-emitting units are quali...

AI Technical Summary

Problems solved by technology

The contact device used not only contains pogo pins, but also includes an air bag. The mechanical structure of the test device is complicated, which is not conducive to production, and there are also problems of uneven force and heat dissipation.

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