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Pad structure and printed circuit board with pad structure

A technology of printed circuit boards and solder pads, which is applied in the direction of printed circuits connected with non-printed electrical components, printed circuit components, electrical connection printed components, etc., which can solve the problem of affecting product quality, increasing production costs, mismatching, etc. question

Inactive Publication Date: 2016-04-06
SHENZHEN FUTAIHONG PRECISION IND CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

However, in actual production, due to material supply or production cost considerations, it is often necessary to replace existing components with components of the same type or similar types from different suppliers, resulting in the pre-designed pads on the PCB being different from the new ones. The components do not match
If the new components are directly assembled on the existing pads, it may lead to poor contact between the components and the PCB or the displacement of the components, which will affect the product quality; if the PCB is redesigned and manufactured, additional production costs will be added. Conducive to the control of production costs

Method used

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  • Pad structure and printed circuit board with pad structure
  • Pad structure and printed circuit board with pad structure
  • Pad structure and printed circuit board with pad structure

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Embodiment Construction

[0015] see figure 1 , the preferred embodiment of the present invention provides a pad structure 10 compatible with different components. In this embodiment, the pad structure 10 is rectangular, and four corners thereof are respectively provided with a welding area 11 , and each welding area 11 includes a first pad 1 , a second pad 2 and a third pad 3 . The first bonding pad 1 , the second bonding pad 2 and the third bonding pad 3 are equivalent in size. The first pad 1 and the third pad 3 are adjacent to the second pad 2, and the center line connecting the first pad 1 and the second pad 2 is connected to the second pad 2 and the second pad 2. The connecting lines between the centers of the three pads 3 are vertical. There is a gap between the first pad 1 , the second pad 2 and the third pad 3 to prevent solder from flowing between different pads during soldering and to prevent excessive parasitic capacitance. In this embodiment, the first pad 1, the second pad 2 and the th...

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Abstract

The invention provides a pad structure for welding elements with different connection ends. The pad structure comprises multiple welding areas; each welding area comprises a first pad, a second pad and a third pad; and the central connection line between the first pad and the second pad is vertical with the central connection line between the second pad and the third pad. In addition, the invention also provides a printed circuit board with the pad structure. The pad structure can be compatible with elements with different connection ends, and welding reliability of the elements can be ensured.

Description

technical field [0001] The invention relates to the field of printed circuit board design, in particular to a pad structure and a printed circuit board with the pad structure. Background technique [0002] In the manufacturing process of consumer electronics products, printed circuit board (Printed Circuit Board, PCB) design and assembly of electronic components are two important links, which are directly related to the performance of the product. In PCB design, it is necessary to set pads corresponding to each component on the PCB according to the pre-drawn circuit schematic diagram, so as to facilitate subsequent welding of each component to the corresponding pad to complete assembly. The planar structure of the pad must be consistent with the shape of the connection end of the component to ensure a stable connection between the connection end of the component and the pad during soldering and assembly, and to avoid poor contact between the component and the PCB due to insu...

Claims

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Application Information

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IPC IPC(8): H05K1/11H05K1/18
Inventor 陈亚男王晓冬
Owner SHENZHEN FUTAIHONG PRECISION IND CO LTD
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