Lens and its cutting method

A cutting method and lens technology, applied in the fields of lenses, optics, instruments, etc., can solve the problems of high production cost, low product yield, strict production process requirements, etc., achieve high vibration reliability, good support force, and reduce production costs Effect

Active Publication Date: 2017-09-05
RUISHENG OPTOELECTRONICS TECH SUZHOU CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] In order to solve the above-mentioned technical problems, the present invention provides a lens and its cutting method. A flexible resin gasket is attached to the surface of any outermost glass wafer of the lens body away from the bonding layer to form the lens, and the lens is formed by Cutting the lens by double-sided cutting not only effectively solves the problems of strict production process requirements, high production cost and low product yield, but also effectively improves production efficiency

Method used

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  • Lens and its cutting method

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Embodiment Construction

[0039] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0040] see figure 1 and figure 2 ,in, figure 1 It is a three-dimensional assembly diagram of the lens provided by the present invention, figure 2 yes figure 1 An exploded perspective view of the lens shown. The lens 1 includes a lens body 11 and a flexible resin spacer 13 . The flexible resin spacer 13 is attached to any one of two opposite surfaces of the lens body 11 .

[0041] The lens body 11 includes n layers of glass wafers 111 and n−1 layers of ...

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Abstract

The invention provides a lens. The lens comprises a lens body and a flexible resin pad. The lens body comprises n layers of glass wafers and n-1 layers of bonding layers provided with through holes, and one bonding layer is clamped between two adjacent layers of glass wafers, wherein n is a positive integer larger than 1. The flexible resin pad is pasted to the surface, far away from the bonding layer, of any outermost glass wafer of the lens body. The invention further provides a cutting method of the lens. According to the invention, the flexible resin pad is pasted to the surface, far away from the bonding layer, of any outermost glass wafer of the lens body, thereby forming the lens, and the lens is cut in a double-face cutting mode, so that the problems of rigid production process requirements, high production cost and low product yield rate are effectively solved, and the production efficiency is effectively improved.

Description

[0001] 【Technical field】 [0002] The invention relates to the field of camera equipment, in particular to a lens and a method for cutting the lens. [0003] 【Background technique】 [0004] With the recent continuous vigorous development of the electronic product industry, all kinds of electronic products make people's life more comfortable and convenient. Many electronic products are facing challenges and require higher yield and quality to meet manufacturing needs. At the same time, the goal of the product is also moving towards smaller and thinner product modules, thereby increasing the competitiveness of the industry. This also puts forward higher requirements for the lens which is an important part of electronic products. [0005] At present, lenses in related technologies are generally cut through the following steps: [0006] Step 1, fix the lens; [0007] Step 2, paste UV (Ultraviolet Rays) film; [0008] Step three, dicing. [0009] Step 1 of the above cutting ste...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02B3/00
CPCG02B3/0012G02B3/0062
Inventor 仇志祥
Owner RUISHENG OPTOELECTRONICS TECH SUZHOU CO LTD
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