High-power semiconductor device pressing and assembling device
A press-fitting device and semiconductor technology, which is applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve the problems of increased contact thermal resistance, high junction temperature, damage and other problems of semiconductor devices, and achieve uniform stress , high economic efficiency, improve the effect of heat dissipation efficiency and service life
Active Publication Date: 2016-04-13
SHANGHAI MARINE EQUIP RES INST
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Problems solved by technology
[0005] The present invention aims at the problems existing in the press-packing structure of high-power semiconductor devices, and proposes a press-packing device for high-power semiconductor devices, which overcomes the increase in contact thermal resistance of semiconductor devices caused by press-packing deviations in the existing structure, resulting in junction The problem of damage caused by excessive temperature
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[0012] Such as figure 1 In the cross-sectional view of the high-power semiconductor device press-fitting device shown, a semiconductor device 5 is sandwiched between two radiators 4 and fixed in two insulating plates 1 . Conductive grease is coated between the radiator 4 and the semiconductor device 5 , and accurate positioning is ensured by positioning pins 12 between the radiator 4 and the semiconductor device 5 . Half of the positioning pin 12 is installed in the installation counterbore of the semiconductor device 5 , and the other half is installed in the installation counterbore of the radiator 4 .
[0013] A cylindrical groove is opened in the middle of the non-contact end surface of the heat sink 4 and the semiconductor device 5 . The cylindrical groove of the bottom mounted radiator 4 is equipped with a guide piece 2 and a disc spring seat 3, and the two sets of disc springs of the guide piece are then set on the disc spring seat 3; The bearing steel ball 7, the low...
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The invention relates to a high-power semiconductor device pressing and assembling device. A semiconductor device is vertically clamped by two heat radiators and fixed in two insulating plates. The heat radiators and the semiconductor device are positioned by a positioning pin. A cylindrical slot is arranged in the exact middle of the noncontact end surface of the two heat radiators and the semiconductor device. Guiding members and disc spring bases are arranged in the cylindrical slots of the heat radiators. The guiding members are sleeved by disc springs and then installed on the disc spring bases in a sleeving way. The aforementioned parts are locked and fixed by four screw rods having the requirement of insulation through penetration. The guiding members and the disc springs are arranged in the cylindrical slots of the heat radiators so that the size of pressing and assembling force can be effectively adjusted, slow deformation of the screw rods and other structural members in the use process can be compensated and installation pre-tightening force of the semiconductor device can be guaranteed; and a high carbon chromium bearing steel ball is installed between the upper and lower disc spring bases and can compensate deviation of flatness and smoothness caused by external pressing and assembling deviation and cumulative machining tolerance of all the parts so that the pressing and assembling direction and angle can be effectively adjusted, force bearing of the semiconductor device is enabled to be uniform and heat radiation efficiency and the service life can be enhanced.
Description
technical field [0001] The invention relates to a power electronic device, in particular to a press-packing device for a high-power semiconductor device. Background technique [0002] The existing domestic high-power rectifiers basically adopt modular structure design, that is, most of them are a small module composed of a semiconductor device and two heat sinks clamped by bolts with insulation requirements. [0003] Due to the large on-state current of high-power semiconductor devices, the conductive contact surface must match it, so the conductive contact surface of low-power semiconductor devices is much larger than that of low-power semiconductor devices. When semiconductor devices are clamped with heat sinks, pre-tightening forces must be applied to both ends of the two heat sinks to ensure that the semiconductor devices and heat sinks are tightly bonded. Small-power devices are usually clamped with a torque wrench, and tightened directly after reaching the specified v...
Claims
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IPC IPC(8): H01L23/32H01L23/40
CPCH01L23/32H01L23/40
Inventor 张洋顾洪俭李婉陈磊丁妍于涛李东升
Owner SHANGHAI MARINE EQUIP RES INST