A method for manufacturing a receiving front end of a broadband transceiver system

Abstract

A method for manufacturing a receiving front end of a broadband transceiver system, comprising a back power board, a front radio frequency circuit board, a connector, a carrier, a housing, upper and lower inner covers, and an outer cover, characterized in that it includes the following steps: making the back power board ; Front RF circuit board, carrier and shell sintering; surface mount components sintering; cementation; back power board, connector assembly; gold wire bonding; testing; sealing. In the present invention, the welding sheet is used for sintering in the production of the front radio frequency circuit board. Only the welding sheet needs to be cut into a circuit shape, and then put into the cavity of the shell to carry out sintering, which not only saves the cost but also greatly improves the penetration rate; in addition , The cone-core inductor used in the production process of the present invention adopts the method of conductive cementation, and does not need to be cleaned after cementation, which overcomes the phenomenon that the insulating varnish that is easily caused by the cleaning of the cone-shaped inductor in the past is easy to fall off.

Description

technical field [0001] The invention relates to a method for manufacturing a receiving front end of a broadband transceiver system, and belongs to the technical field of microwave circuit communication and the field of micro-assembly technology. Background technique [0002] At present, the sintering of the receiving front-end RF receiving circuit and the housing generally uses the printed solder paste of the RF circuit board and puts it into the housing cavity for reflow soldering and sintering. Although this method is relatively simple, the cavity after sintering is relatively large, and the penetration rate is difficult to meet the requirements. Every time a new product is made, it is necessary to make a new screen printing screen, which is a waste of cost. The starting point of the present invention is to use solder tabs for sintering in the production of front radio frequency circuit boards. Only the solder tabs need to be cut into circuit shapes and put into the cavity...

AI Technical Summary

Problems solved by technology

[0002] At present, the sintering of the receiving front-end RF receiving circuit and the housing generally uses the printed solder paste of the RF circuit board and puts it into the housing cavity for reflow soldering and sintering. Although this method is relatively simple, the cavity after sintering is relatively large, and the penetration rate is difficult to meet the requirements. Every time a new product is made, it is necessary to make a new screen printing screen, which is a waste of cost