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Rotary workpiece stage adopting base cooling rotary workpiece

A technology for cooling rotating and rotating workpieces, applied to electrical components, discharge tubes, circuits, etc., can solve problems such as manufacturing difficulties, low work reliability, and complicated workpiece table design, and achieve the effect of simple mechanism

Active Publication Date: 2016-05-04
48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, through long-term practice, it is found in the actual use process that the workpiece table with this structure has the problems of complicated design, difficult manufacture, high cost, low working reliability and high maintenance cost.

Method used

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  • Rotary workpiece stage adopting base cooling rotary workpiece
  • Rotary workpiece stage adopting base cooling rotary workpiece
  • Rotary workpiece stage adopting base cooling rotary workpiece

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Embodiment 1: as figure 1 , figure 2 and image 3 As shown, the rotary workpiece table using the base to cool the rotating workpiece of the present invention includes a base 1 and more than one wafer mounting table 2, the base 1 is a rotatable base, and it has a mechanism for driving the base to rotate and supports structure (not shown in the figure); the wafer mounting table 2 is used to install the wafer, and it can be rotatable or fixed according to actual needs; the back of the wafer mounting table 2 is attached to the base 1 . A cooling liquid cavity 4 is provided on the side of the base 1 close to the wafer mounting platform 2 , and a cooling liquid inlet 3 and a cooling liquid outlet 5 are provided on the side of the base 1 away from the wafer mounting platform 2 . With this structure, the base 1 can be directly cooled through the cooling liquid chamber 4 , and then the rotating workpiece table for cooling the wafer mounting table 2 for mounting wafers can be ...

Embodiment 2

[0027] Embodiment 2: as Figure 4 As shown, the structure of this embodiment is basically the same as that of Embodiment 1, the difference is that the connection between the base 1 and the back of the wafer mounting table 2 is not in close contact, but between the two surfaces. Distributed is a cavity 7 filled with a fluid heat conducting material, which is a sealed cavity. In a specific example, a labyrinth seal 8 can be used for sealing. In this way, the heat conduction efficiency can be greatly improved by using the fluid heat conduction material in the chamber 7, so that the wafer mounting table 2 can be cooled better.

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Abstract

The invention discloses a rotary workpiece stage adopting a base cooling rotary workpiece. The rotary workpiece stage comprises a base and more than one wafer mounting tables mounted on the base; the wafer mounting tables are used for mounting wafers; one surface of the base, which is adjacent to the wafer mounting tables, is provided with a cooling liquid chamber; and the cooling liquid chamber is filled with cooling liquid for cooling the base and the wafer mounting tables. The rotary workpiece stage of the invention has the advantages of simple structure and stable, reliable work and the like, and can meet the requirements of high-vacuum work.

Description

technical field [0001] The invention mainly relates to the field of ion beam etching equipment, in particular to a rotating workpiece table using a base to cool the rotating workpiece. Background technique [0002] Ion beam etching is a material removal process commonly used in the semiconductor industry. Before etching, photoresist is generally used to carve a certain pattern on the surface of the wafer. The etching process will etch away the parts that are not covered by the photoresist and leave the parts covered by the photoresist, so as to achieve the desired effect. process effect. In the high-dose ion beam etching process, due to ion bombardment, a large amount of heat will be generated on the surface of the wafer. If the heat dissipation is not good, the photoresist may melt, resulting in the failure of the etching process. [0003] Among the evaluation indexes of etching process, one of the most important indexes is the uniformity of etching. In order to improve ...

Claims

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Application Information

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IPC IPC(8): H01J37/32
CPCH01J37/32724
Inventor 罗才旺魏唯陈特超佘鹏程陈庆广
Owner 48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP