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Novel crimping type IGBT module

A crimping and new technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of inconsistent stray inductance, reducing the safe working area of ​​devices, and uneven current flow, so as to achieve small pressure difference and reduce Geometric position difference, effect of improving reliability

Active Publication Date: 2016-05-04
GLOBAL ENERGY INTERCONNECTION RES INST CO LTD +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For the Westcode device structure, the existing research results show that with the increase of the number of bosses, due to the inconsistency of the stray inductance, the current between the bosses has a problem of uneven flow during the turn-on and turn-off process. And some chips have a large current overshoot during the turn-on process, which reduces the overall safe working area of ​​the device.

Method used

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  • Novel crimping type IGBT module
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  • Novel crimping type IGBT module

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Embodiment Construction

[0031] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0032] In order to thoroughly understand the embodiments of the present invention, the detailed structure will be set forth in the following description. Obviously, the practice of the embodiments of the invention is not limited to specific details familiar to those skilled in the art. Preferred embodiments of the present invention are described in detail below, however, the present invention may have other embodiments besides these detailed descriptions.

[0033] The outside of the high-power crimping type IGBT module provided by the present invention is composed of a tube case and two metal electrode plates arranged at the upper and lower ends of the tube case, and the inside is a power sub-module and corresponding bosses.

[0034] The boss is installed on the metal electrode 3 at the lower end. In order to reduce the...

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Abstract

The invention provides a novel crimping type IGBT module. The novel crimping type IGBT module comprises a tube shell, and platy metal electrodes coaxially arranged at the upper and lower ends of the tube shell, wherein lug bosses are fixed on the inner side face of the metal electrode at the lower end; power sub modules are crimped between the lug bosses and the metal electrode at the upper end; the lug bosses are arranged by taking the center of the metal electrode at the lower end as the center of a circle; and the lug bosses are distributed on the inner side face of the metal electrode at the lower end circumferentially from the inner layer to the outer layer at an equidistributed manner in sequence. According to the technical scheme of the novel crimping type IGBT module provided by the invention, the problem of overhigh overshoot of partial current when transient state current passes through the lug bosses of the crimping type IGBT module is solved; and the reliability of the crimping type IGBT module is improved, and the safety operation area of the crimping type IGBT module is enlarged.

Description

technical field [0001] The invention relates to a crimping type IGBT module, in particular to a crimping type IGBT module capable of reducing the IGBT switching transient current overshoot. Background technique [0002] In 1993, Fuji Corporation first proposed the concept of μ-stack, which combined the common advantages of GTO and IGBT. It was extensively researched in the late 1990s, and the commercialization of press-fit IGBT was carried out around 2005. Produce. The two mainstream products currently on the market are ABB's StakPak and Westcode's PressPackIGBT. In addition, Toshiba's IEGT device is similar to this. The press-connect IGBT has the advantages of high switching frequency, failure short circuit, double-sided heat dissipation, and easier series connection. It is very suitable for applications such as electric locomotives and VSC-HVDC. Compared with the traditional soldered IGBT module, the press-fit IGBT module has a smaller stray inductance of the chip circui...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/10H01L29/739
CPCH01L23/10H01L29/7393
Inventor 刘文广张朋李金元赵志斌崔翔唐新灵
Owner GLOBAL ENERGY INTERCONNECTION RES INST CO LTD
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