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A Single Board Based on Balanced Coupling of Heat Dissipation and Noise Reduction and Analog Single Board

A noise reduction and balanced technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, casing/cabinet/drawer parts, etc., can solve the problem that communication equipment cannot have both heat dissipation and noise reduction performance, etc. To achieve the effect of increasing space

Active Publication Date: 2018-05-29
FENGHUO COMM SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is that the single board of the existing communication equipment cannot have good heat dissipation and noise reduction performance

Method used

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  • A Single Board Based on Balanced Coupling of Heat Dissipation and Noise Reduction and Analog Single Board
  • A Single Board Based on Balanced Coupling of Heat Dissipation and Noise Reduction and Analog Single Board
  • A Single Board Based on Balanced Coupling of Heat Dissipation and Noise Reduction and Analog Single Board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Such as Figure 5 , Image 6 with Figure 7 As shown, the present invention provides a high-power veneer based on the balanced coupling of heat dissipation and noise reduction, including a box body for air flow inside. The box body consists of a front panel 1, a rear panel 2 equipped with connectors, an upper cover The board 3 and the bottom plate 4 are detachably connected or welded in sequence, and the two ends of the box body are open to form an air inlet and an air outlet respectively. A PCB board 7 is arranged in the box body, and electrical components are installed on the PCB board 7 . 7 is also provided with a heat dissipation module 6, and the heat dissipation module 6 is preferably arranged in the center of the box body to facilitate heat dissipation.

[0032] A noise-reducing air guide module 5 protrudes from any inner side of the box body to the inside of the box body, and the protruding direction of the noise-reducing air guide module 5 is perpendicular to...

Embodiment 2

[0037] Such as Figure 8 As shown, since this embodiment provides a low-power single board based on the balanced coupling of heat dissipation and noise reduction, the difference between this embodiment and Embodiment 1 is mainly that the heat dissipation device 6 inside the box is smaller in size, and the cold area The area of ​​the air flow section is relatively large, the flow resistance is small, and the cooling air is easy to pass through, resulting in a mismatch of cooling air distribution between the low-power single board and the high-power single board.

[0038] In order to solve this problem, this embodiment includes a box body that can allow air flow inside, and the box body is detachably connected or welded in sequence by the front panel 1, the rear panel 2 equipped with connectors, the upper cover plate 3 and the bottom plate 4 Composition, and the two ends of the box body are open to form an air inlet and an air outlet respectively, a PCB board 7 is arranged in the ...

Embodiment 3

[0043] Such as Figure 9 As shown, this embodiment provides an analog veneer 10 based on the balanced coupling of heat dissipation and noise reduction, which is composed of a box body for air flow inside. The two ends of the box body have openings and respectively form an air inlet and an air outlet. The box body is arranged with several square-shaped noise-reducing air-guiding modules 5, each noise-reducing air-guiding module 5 is evenly distributed along the width direction of the box body, and the noise-reducing air-guiding module 5 divides the box body into several airflow channels 13, When the noise reduction guide module 5 is arranged along the width direction of the box body, due to the limitation of the thickness of the sound-absorbing material, the effect of the analog veneer 10 on reducing the low-frequency noise of the equipment is obvious.

[0044] The cross-sectional area occupied by the noise-reducing flow guide module 5 in the simulation board 10 is reasonably s...

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Abstract

The invention discloses a single board and a simulative single board based on balance between improvement of thermal dissipation capability and reduction of noise emission. The single board based on balance between improvement of thermal dissipation capability and reduction of noise emission comprises a box body capable of providing air flow in the interior; the two ends of the box body are open to form an air inlet and an air outlet; noise reduction flow guide modules are arranged on any inner side faces of the box body in a protruding manner; and the protruding directions of the noise reduction flow guide modules are perpendicular to the air flow direction in the box body. According to the single board provided by the invention, different noise reduction flow guide modules perpendicular to the air flow direction are arranged in different communication equipment single boards, so that cooled air can pass through components and parts requiring to be cooled in an efficient and balanced manner; meanwhile, the noise reduction flow guide modules can eliminate noises generated in the cooling process; therefore, the contradiction between improvement of thermal dissipation capability and requirement for lowering noise emission existing in the communication equipment is solved; instead, the thermal dissipation capability of the equipment is improved while the noise emission of the equipment is lowered; and meanwhile, the occupied space of the equipment in installation is not enlarged.

Description

technical field [0001] The invention relates to heat dissipation and noise control technology, in particular to a single board and an analog single board based on balanced coupling of heat dissipation and noise reduction. Background technique [0002] As the power consumption of communication equipment continues to increase, the heat dissipation problem of the equipment becomes more and more prominent. The traditional solution is to continuously increase the speed and wind pressure of the cooling fan to provide sufficient cooling air. However, this method not only greatly increases power consumption, but also sharply increases the noise emission of the equipment, which has a serious impact on people's daily work, life and health. Statistics show that the incidence rate of noise-induced deafness is 1% within 5 years after being exposed to an environment with a sound pressure level of 85dBA, while the incidence rate of noise-induced deafness within 5 years reaches 4% when expo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H05K5/02
CPCH05K5/0213H05K7/20145
Inventor 姬生钦
Owner FENGHUO COMM SCI & TECH CO LTD