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A kind of lightweight epoxy resin composite material and preparation method thereof

A technology of epoxy resin and composite materials, which is applied in the field of electromagnetic shielding materials and polymer conductive materials, can solve the problems of inability to obtain high electrical conductivity and electromagnetic shielding performance, poor mechanical properties of materials, and non-corrosion resistance, etc., and achieve good industrialization Foregrounding, productive, easy-to-achieve effects

Active Publication Date: 2018-12-04
SICHUAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Traditionally, metal materials with excellent electromagnetic shielding performance are usually used as electromagnetic shielding materials, but they have many disadvantages such as high density, high cost, and poor corrosion resistance, which cannot meet the increasingly high requirements of modern society for electromagnetic shielding materials. , for example, in the field of aerospace, not only is the material required to have excellent electromagnetic shielding performance, but also the material is required to maintain a high enough mechanical strength while reducing the density to increase the payload of the aircraft
[0005] It is well known that the properties of various aspects of materials often form conflicts that restrict each other, especially for epoxy resins, if the material is required to have high conductivity and / or high electromagnetic shielding performance, it is usually necessary to increase the amount of conductive filler , but increasing the amount of conductive filler will often lead to poor mechanical properties of the material; while reducing the amount of conductive filler in the material, high conductivity and electromagnetic shielding performance cannot be obtained. Reports on conductive, high electromagnetic shielding epoxy resin materials; it is often very difficult for those skilled in the art to simultaneously improve the performance of various aspects of electromagnetic shielding materials

Method used

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  • A kind of lightweight epoxy resin composite material and preparation method thereof
  • A kind of lightweight epoxy resin composite material and preparation method thereof
  • A kind of lightweight epoxy resin composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0084] (1) Preparation of expandable epoxy resin mixture

[0085] Take 100g of E51 epoxy resin, add multi-walled carbon nanotubes according to the ratio in Table 1, and mix at least five times on a three-roll shear mixer to obtain a uniformly dispersed carbon nanotube / epoxy resin mixture. Then add polymer expanded microspheres EXPANCEL in sequence TM 031DU40, 32g polyether amine curing agent BAXXODUR TM EC301, and mix well to get the expandable epoxy resin mixture.

[0086] (2) Preparation of silver-plated melamine formaldehyde (MF) foam

[0087] The MF open-cell foam (Basotect W) with a size of 4 cm × 3 cm × 0.5 cm was placed in an ethanol solution and cleaned under ultrasound for 30 min to remove surface impurities; the cleaned MF foam was placed at a temperature of 65 °C and a concentration of Soak in 12g / L sodium hydroxide solution for about 30min to roughen the surface, then take out the distilled water and wash it; put the roughened foam in the hydrochloric acid sol...

Embodiment 2

[0093] (1) Prepare the expandable epoxy resin mixture.

[0094] Take 100g of NPEL-128 epoxy resin, add 3g of multi-walled carbon nanotubes, and mix on a three-roll shear mixer to obtain a uniformly dispersed carbon nanotube / epoxy resin mixture. Then add 1.5g polymer expansion microsphere EXPANCEL TM 051DU 40, 50g polyamide curing agent V140, stir well to get the expandable epoxy resin mixture.

[0095] (2) Preparation of nickel-plated polyurethane (PU) foam.

[0096] Put the PU (4cm×3cm×0.5cm) foam in an ethanol solution and clean it under ultrasonic for 30min to remove surface impurities; put the cleaned PU foam in sodium hydroxide with a temperature of 65°C and a concentration of 12g / L Soak in the solution for about 30 minutes to roughen the surface, then take out the distilled water and wash it; soak the roughened PU foam in the hydrochloric acid solution of stannous chloride (12g / L SnCl 2 and 5ml / L conc 2 ) for 20 minutes; place the activated PU foam in a nickel pla...

Embodiment 3

[0100] (1) Prepare the expandable epoxy resin mixture.

[0101] Take 100g of E51 epoxy resin, add 3.5g of conductive carbon black, then mix well on a three-roller shear mixer to obtain a conductive carbon black / epoxy resin mixture, and then add a certain amount of surface coupling treatment according to the formula in Table 2 glass cenospheres (3M TM , particle size 15-120μm), and then add 15g of triethanolamine / triethylenetetramine (4:3) and mix well to obtain the expandable epoxy resin mixture.

[0102] (2) Preparation of nickel-plated PVC foam.

[0103] Put the open-cell PVC foam (4cm×3cm×0.5cm) in distilled water and clean it under ultrasonic for 30min to remove surface impurities; put the cleaned PVC foam in the hydrogen oxidation solution with a temperature of 50°C and a concentration of 12g / L Soak in sodium solution for about 30 minutes to roughen the surface, then take out distilled water and wash; put the roughened PVC foam in a hydrochloric acid solution of stannou...

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Abstract

The invention discloses a light-weight epoxy resin composite material, which is prepared from an expandable epoxy resin mixture and metallized foam, wherein the ratio of the weight of the expandable epoxy resin mixture to the volume of the metallized foam is greater than or equal to 0.2g / cm<3>. The light-weight epoxy resin composite material has various advantages of low density, high mechanical strength, low electrical resistivity, excellent electromagnetic shielding performance and the like, and is very suitable for being applied as a conducting material and / or an electromagnetic shielding material; in addition, a preparation method of the light-weight epoxy resin composite material is simple and convenient; the energy consumption is low; the production efficiency is high; good industrialization prospects are realized.

Description

technical field [0001] The invention belongs to the field of polymer conductive and electromagnetic shielding materials, in particular to an epoxy resin composite material with light weight, high conductivity and high electromagnetic shielding and a preparation method thereof. Background technique [0002] With the development of modern high-tech, electromagnetic interference and electromagnetic compatibility problems caused by electromagnetic waves are becoming more and more serious, which not only cause interference and damage to electronic instruments and equipment, affect their normal work, seriously restrict the international competitiveness of my country's electronic products and equipment, but also It will pollute the environment and endanger human health; in addition, the leakage of electromagnetic waves will also endanger the security of national information security and military core secrets. [0003] The key factor to solve the above problems is to explore and deve...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L61/28C08L75/04C08L27/06C08L79/08C08K7/24C08K3/04C08J9/14C08J9/12C08J9/06C08J9/10
CPCC08J9/06C08J9/104C08J9/12C08J9/14C08J2203/04C08J2203/22C08J2363/00C08J2427/06C08J2461/28C08J2475/04C08J2479/08C08K2201/001C08K2201/011C08L63/00C08L2203/14C08L61/28C08K7/24C08L75/04C08L27/06C08K3/04C08K7/06C08L79/08
Inventor 包建军张爱民徐雨
Owner SICHUAN UNIV
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