The invention discloses an organosilicon composite material and a preparation method thereof. The composite material is prepared from alkylene-containing polysiloxane, hydrogen-containing polysiloxane, epoxide group polysiloxane, a heat-conduction filling material, a hydrosilation catalyst, a reaction inhibitor and the like through mixing and curing. The prepared organosilicon composite material has the characteristics of low content of volatile compounds, resistance to high and low temperature, high heat conduction, light weight, high strength, good cementability, electrical insulating properties, etc., can meet development demands of functional assemblies for large power, microminiaturization, lightweight and high reliability, and is applicable as a badly-needed high-performance heat-conducting insulating material in military fields like aviation, spaceflight and weapons and in fields related to people's livelihood, e.g., an LED illumination system and an electronic circuit integration system.