Organosilicon composite material and preparation method thereof

A composite material and silicone technology, which is applied in the field of high-performance silicone composite materials and its preparation, can solve the problems of increased low-temperature shrinkage of silicone rubber, cumbersome filler treatment process, and inability to meet special environmental requirements, etc.

Active Publication Date: 2015-12-30
HUNAN BOOM NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Chinese invention patent [CN102786721A] discloses a high-strength and high-thermal-conduction insulating material, which uses chopped beryllium-containing silicon carbide fibers with an aspect ratio of 2-100, zinc oxide whiskers, alumina, boron nitride or mica as thermally conductive fillers. The prepared thermal insulating material has high strength and excellent thermal conductivity, but the filler treatment process is cumbersome, the process operability is not good, and the use of conventional polysiloxane oligomers cannot meet the special environmental requirements of aviation, aerospace, weapons and other fields
In the field of aerospace, there are harsh space envi

Method used

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  • Organosilicon composite material and preparation method thereof
  • Organosilicon composite material and preparation method thereof
  • Organosilicon composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0066] Example 1

[0067] Add 30 parts of vinyl polysiloxane to the vacuum kneader: (a is 200, the viscosity is 0.47Pa.s,)

[0068]

[0069] (The vinyl content is 0.535%), add 39μm spherical alumina (KH-560 treatment), stir for 45min, then add 4.7μm spherical alumina (KH-560 treatment), stir for 45min, and finally add 0.5μm spherical alumina (KH-560 treatment) -560 treatment), stirred for 45min, then added in turn the beryllium-containing silicon carbide fibers with an aspect ratio of 2 to 5 treated with KH-560, a total of 400 parts, kneaded at 120 ° C for 2 hours and cooled to room temperature, then transferred to a vacuum type Add 20 parts of vinyl polysiloxane and 2.6 parts to the high-speed disperser (where m=20, viscosity (25°C) is 15mPa.s, mass fraction of hydrogen is 1.48%), 2.5 parts of epoxy polysiloxane: 0.01 part of 3-methyl-3-penten-1-yne, stirred for 1 hour, vacuum degassed, and discharged.

[0070] Add 30 parts of olefin-based polysiloxane to the vacuum kn...

Example Embodiment

[0073] Example 2

[0074] Add 30 parts of vinyl polysiloxane to the vacuum kneader: (a is 120, viscosity is 0.29Pa.s,) (the vinyl content is 0.87%)

[0075]

[0076] , add 45um spherical alumina (KH-560 treatment), stir for 45min, then add 5um spherical alumina (KH-560 treatment), stir for 45min, finally add 0.5um spherical alumina (KH-560 treatment), stir for 45min, then Add KH-560-treated four-needle zinc oxide whiskers, a total of 430 parts, knead at 120°C for 2 hours and cool down to room temperature, then transfer to a vacuum-type high-speed disperser and add 20 parts of vinyl polysiloxane, 5.5 share (where m=20, viscosity (25°C) is 15mPa.s, mass fraction of hydrogen is 1.48%), 2 parts of epoxy polysiloxane:

[0077]

[0078] , 0.01 part of 3-methyl-3-penten-1-yne, stirred for 60 minutes, vacuum defoamed, and discharged.

[0079] Add 30 parts of vinyl polysiloxane to the vacuum kneader, add 45um (KH-560 treatment) spherical alumina, stir for 45min, then add 5um ...

Example Embodiment

[0082] Example 3

[0083] Add 30 parts of alkenyl-containing polysiloxane to the vacuum kneader: (a is 120, viscosity is 0.29Pa.s,) (the vinyl content is 0.87%)

[0084]

[0085] , add 45um (KH-560 treatment) spherical alumina, stir for 45min, then add 5um (KH-560 treatment) spherical alumina, stir for 45min, finally add 0.5um (KH-560 treatment) spherical alumina, stir for 45min, then Add KH-560 to treat beryllium-containing silicon carbide fibers with an aspect ratio of 2 to 5, a total of 380 parts, knead at 120°C for 2 hours and cool down to room temperature, transfer to a vacuum-type high-speed disperser and add 20 parts of olefin-based Polysiloxane, 5.5 parts (where m=20, viscosity (25°C) is 15mPa.s, mass fraction of hydrogen is 1.48%), 2.1 parts of epoxy polysiloxane:

[0086] 0.01 part of 3-methyl-3-penten-1-yne, stirred for 60 minutes, vacuum degassed, and discharged.

[0087] Add 30 parts of olefin-based polysiloxane to the vacuum kneader, add 5um (KH-560 trea...

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Abstract

The invention discloses an organosilicon composite material and a preparation method thereof. The composite material is prepared from alkylene-containing polysiloxane, hydrogen-containing polysiloxane, epoxide group polysiloxane, a heat-conduction filling material, a hydrosilation catalyst, a reaction inhibitor and the like through mixing and curing. The prepared organosilicon composite material has the characteristics of low content of volatile compounds, resistance to high and low temperature, high heat conduction, light weight, high strength, good cementability, electrical insulating properties, etc., can meet development demands of functional assemblies for large power, microminiaturization, lightweight and high reliability, and is applicable as a badly-needed high-performance heat-conducting insulating material in military fields like aviation, spaceflight and weapons and in fields related to people's livelihood, e.g., an LED illumination system and an electronic circuit integration system.

Description

technical field [0001] The invention relates to a high-performance organosilicon composite material and a preparation method thereof, belonging to the technical field of heat-conducting and insulating organosilicon composite materials. Background technique [0002] Electronic devices, especially high-power and miniaturized electronic components, will generate a lot of heat during the operation process. If the heat dissipation is not timely, the accumulated excessive heat will affect the normal operation of the components, and in severe cases, the electronic components will fail. even lead to accidents. According to data, the reliability of electronic components decreases by 10% when the temperature increases by 2°C; when the operating temperature of electronic components increases by 10°C, the service life can be shortened by 5 to 8 times. The main problem with improving reliability. [0003] In order to solve the heat accumulation problem of the electronic device module a...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08L83/06C08K13/06C08K9/06C08K7/10C08K7/08C08K3/22
Inventor 袁杰胡肖波黄小忠
Owner HUNAN BOOM NEW MATERIALS
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