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A kind of organosilicon composite material and preparation method thereof

A composite material and organosilicon technology, which is applied in the field of high-performance organosilicon composite materials and its preparation, can solve problems such as inability to meet special environmental requirements, brittle materials, failure of thermal insulation materials, etc.

Active Publication Date: 2019-04-05
HUNAN BOOM NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Chinese invention patent [CN102786721A] discloses a high-strength and high-thermal-conduction insulating material, which uses chopped beryllium-containing silicon carbide fibers with an aspect ratio of 2-100, zinc oxide whiskers, alumina, boron nitride or mica as thermally conductive fillers. The prepared thermal insulating material has high strength and excellent thermal conductivity, but the filler treatment process is cumbersome, the process operability is not good, and the use of conventional polysiloxane oligomers cannot meet the special environmental requirements of aviation, aerospace, weapons and other fields
In the field of aerospace, there are harsh space environmental conditions such as alternating high and low temperatures. Although silicone rubber has excellent high and low temperature resistance, when it is lower than -70°C, the material tends to become brittle, and the low temperature shrinkage of silicone rubber increases significantly. Lead to failure of thermally conductive insulating materials
At the same time, under the synergistic effect of space environment vacuum and high and low temperature alternating, a small amount of non-reactive low molecular weight substances in the silicone rubber base polymer and by-products in the vulcanization process escape, which will cause serious thermal vacuum outgassing problems

Method used

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  • A kind of organosilicon composite material and preparation method thereof
  • A kind of organosilicon composite material and preparation method thereof
  • A kind of organosilicon composite material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0068] Add 30 parts of vinyl polysiloxane into the vacuum kneader: (a is 200, viscosity is 0.47Pa.s,)

[0069]

[0070] (Wherein the vinyl content is 0.535%), add 39μm spherical alumina (KH-560 treatment), stir for 45min, then add 4.7μm spherical alumina (KH-560 treatment), stir for 45min, and finally add 0.5μm spherical alumina (KH -560 treatment), stir for 45min, and then sequentially add the beryllium-containing silicon carbide fibers treated with KH-560 with a length to diameter ratio of 2 to 5, a total of 400 parts, knead at 120°C for 2 hours and cool to room temperature, then transfer to vacuum type Add 20 parts of vinyl polysiloxane and 2.6 parts to the high-speed disperser (Where m=20, viscosity (25°C) is 15mPa.s, and the mass fraction of hydrogen is 1.48%), 2.5 parts of epoxy polysiloxane: 0.01 parts of 3-methyl-3-pentene-1-yne, stirred for 1 hour, vacuum degassed, and discharged.

[0071] Add 30 parts of olefin-based polysiloxane to the vacuum kneader, add 39μm spherica...

Embodiment 2

[0075] Add 30 parts of vinyl polysiloxane into the vacuum kneader: (a is 120, viscosity is 0.29Pa.s,) (wherein the vinyl content is 0.87%)

[0076]

[0077] , Add 45um spherical alumina (KH-560 treatment), stir for 45min, then add 5um spherical alumina (KH-560 treatment), stir for 45min, finally add 0.5um spherical alumina (KH-560 treatment), stir for 45min, then Add the four-pin zinc oxide whiskers treated by KH-560, totaling 430 parts, kneading at 120°C for 2h and cooling to room temperature, transfer to a vacuum high-speed disperser and add 20 parts of vinyl polysiloxane, 5.5 Share (Where m=20, viscosity (25°C) is 15mPa.s, and the mass fraction of hydrogen is 1.48%), 2 parts of epoxy polysiloxane:

[0078]

[0079] , 0.01 part of 3-methyl-3-pentene-1-yne, stir for 60min, degas in vacuum, and discharge.

[0080] Add 30 parts of vinyl polysiloxane to the vacuum kneader, add 45um (KH-560 processed) spherical alumina, stir for 45 minutes, then add 5um (KH-560 processed) spherical al...

Embodiment 3

[0084] Add 30 parts of alkenyl-containing polysiloxane into the vacuum kneader: (a is 120, viscosity is 0.29Pa.s,) (the vinyl content is 0.87%)

[0085]

[0086] , Add 45um (KH-560 treatment) spherical alumina, stir for 45min, then add 5um (KH-560 treatment) spherical alumina, stir for 45min, finally add 0.5um (KH-560 treatment) spherical alumina, stir for 45min, then Add KH-560 to treat beryllium-containing silicon carbide fibers with a length-to-diameter ratio of 2-5, a total of 380 parts, knead at 120℃ for 2h and cool to room temperature, transfer to a vacuum high-speed disperser and add 20 parts of olefin base Polysiloxane, 5.5 parts (Where m=20, viscosity (25°C) is 15mPa.s, and the mass fraction of hydrogen is 1.48%), 2.1 parts of epoxy polysiloxane:

[0087] 0.01 part of 3-methyl-3-pentene-1-yne, stirred for 60 minutes, vacuum degassed, and discharged.

[0088] Add 30 parts of olefin-based polysiloxane to the vacuum kneader, add 5um (KH-560 processed) spherical alumina, stir...

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Abstract

The invention discloses an organosilicon composite material and a preparation method thereof. The composite material is prepared from alkylene-containing polysiloxane, hydrogen-containing polysiloxane, epoxide group polysiloxane, a heat-conduction filling material, a hydrosilation catalyst, a reaction inhibitor and the like through mixing and curing. The prepared organosilicon composite material has the characteristics of low content of volatile compounds, resistance to high and low temperature, high heat conduction, light weight, high strength, good cementability, electrical insulating properties, etc., can meet development demands of functional assemblies for large power, microminiaturization, lightweight and high reliability, and is applicable as a badly-needed high-performance heat-conducting insulating material in military fields like aviation, spaceflight and weapons and in fields related to people's livelihood, e.g., an LED illumination system and an electronic circuit integration system.

Description

Technical field [0001] The invention relates to a high-performance organic silicon composite material and a preparation method thereof; it belongs to the technical field of thermally conductive and insulating organic silicon composite materials. Background technique [0002] Electronic components, especially high-power and miniaturized electronic components, will generate a lot of heat during the operation. If the heat is not timely, the accumulated heat will affect the normal operation of the components, and the electronic components will fail in severe cases. Even lead to accidents. According to data, every time the temperature of electronic components increases by 2°C, the reliability decreases by 10%; every time the temperature of electronic components increases by 10°C, the service life can be shortened by 5 to 8 times. Therefore, heat dissipation becomes an electronic component that increases the service life and The main problem to improve reliability. [0003] In order to...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L83/07C08L83/05C08L83/06C08K13/06C08K9/06C08K7/10C08K7/08C08K3/22
Inventor 袁杰胡肖波黄小忠
Owner HUNAN BOOM NEW MATERIALS
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