Modified phenyl organosilicone composition for LED packaging

A phenyl silicone, LED packaging technology, used in adhesive additives, non-polymer adhesive additives, electrical components, etc. and other problems to achieve the effect of improving mechanical properties, maintaining high and low temperature resistance, and improving mechanical properties

Inactive Publication Date: 2017-03-15
SHANGHAI YEADEA CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To solve this problem, one is to add fumed silica for reinforcement, but it will affect the light transmittance and fluidity; the other is to use phenyl vinyl silicone resin for reinforcement, but the low temperature resistance and bonding performance are poor; the third is to use Modified phenyl vinyl silicone resin reinforcement, the existing published research is to use epoxy resin modification, such as Japanese patent (JP, 2007002233[P].2007-01-11), the disadvantage is the residual epoxy group , making the material easy to turn yellow and affecting the light transmittance

Method used

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  • Modified phenyl organosilicone composition for LED packaging
  • Modified phenyl organosilicone composition for LED packaging
  • Modified phenyl organosilicone composition for LED packaging

Examples

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Comparison scheme
Effect test

Embodiment 1

[0030] This embodiment relates to a modified phenyl silicone composition for LED packaging, specifically as follows:

[0031] 100 parts of component one, its Si-OH content is 0.2%, add 10 parts of polyols such as structural formula 4, 1 part of polyols of structural formula 1, 0.01 g of aluminum acetylacetonate in component five, stir and mix evenly, and then add 0.1 gram Pt content is the complex compound of 2%, stir evenly, add component two 6 grams, stir evenly and defoam to form encapsulating material. Curing at 150°C for 4 hours, measuring hardness, tensile strength, refractive index, light transmittance, and light transmittance at 100°C for 1000 hours.

Embodiment 2

[0033] This embodiment relates to a modified phenyl silicone composition for LED packaging, specifically as follows:

[0034] 100 parts of component one, whose Si-OH content is 0.1%, add 15 parts of polyols such as structural formula 3 in component five, 0.01 g of aluminum acetylacetonate, stir and mix evenly, and then add 0.1 g of Pt content of 2%. Compound, stir evenly, add 6 grams of component two, stir evenly and defoam to form an encapsulation material. Curing at 150°C for 4 hours, measuring hardness, tensile strength, refractive index, light transmittance, and light transmittance at 100°C for 1000 hours.

Embodiment 3

[0036] This embodiment relates to a modified phenyl silicone composition for LED packaging, specifically as follows:

[0037] 100 parts of component 1, its Si-OH content is 0.12%, add 8 parts of polyol of structural formula 4 and 1 part of polyol of structural formula 1, 0.02 g of tetraisopropanol titanate in component 5, stir and mix well , then add 0.1 gram of a complex compound with a Pt content of 2%, stir evenly, add 5 grams of component two, stir evenly to degas the encapsulation material. Curing at 150°C for 4 hours, measuring hardness, tensile strength, refractive index, light transmittance, and light transmittance at 100°C for 1000 hours.

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Abstract

The invention discloses a modified phenyl organosilicone composition for LED packaging. The modified phenyl organosilicone composition is prepared from 100 parts of phenyl vinyl polysiloxane, 5-6 parts of organosilicone hydrogen-containing oligomer, 0.1 part of complex, 0.01-0.02 part of metallic organics and 5-15 parts of polyhydric alcohol. Polyhydric alcohol is adopted for improving the mechanical performance of phenyl silicone rubber, the mechanical performance of the phenyl silicone rubber is improved, and the high-low-temperature resistance and original anti-yellowing performance of the silicone rubber are kept. The modified phenyl organosilicone composition can be used for packaging or optical adhesives of high-power light-emitting diodes.

Description

technical field [0001] The invention relates to a group of phenyl silicone compositions, especially modified phenyl silicone compositions for LED packaging. Background technique [0002] Phenyl silicone rubber addition type phenyl silicone rubber has the properties of optical transparency, radiation resistance, high and low temperature resistance, low air permeability and moisture permeability. It is an important protective material for semiconductors, electronics, motors, etc. to operate under harsh conditions. A typical example is the packaging of high-power light-emitting diodes (high-power LEDs). Traditional LEDs are often packaged with epoxy resin, and developed to high-power LEDs. Due to The temperature of the chip is high and the chip is irradiated by ultraviolet light. The epoxy resin is easy to turn yellow and the light transmittance decreases. The addition-type phenyl silicone rubber package completely solves the problem of light transmittance decrease. However,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/06C08L83/05C08K5/00C08K5/053C09J183/06C09J183/05C09J11/06H01L33/56
CPCC08L83/06C08K2201/014C08L2201/08C08L2205/02C09J11/06C09J183/06H01L33/56
Inventor 麦宏俊陈莅威姬学辉
Owner SHANGHAI YEADEA CHEM CO LTD
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