Polymer-based composite thermally conductive material and its preparation method and application

Abstract

The invention relates to a polymer-based composite heat-conducting material, a preparation method and application thereof. The polymer-based composite thermally conductive material includes a polymer matrix and a filler, the filler accounts for 32%-40% by mass of the polymer matrix, and the filler is flake boron nitride and spherical boron nitride according to the mass ratio 1: (2-4 ) mixture, the particle size of spherical boron nitride is 50μm-60μm, the thickness of flake boron nitride is 4nm-10nm, and the sheet diameter is 4μm-5μm. Flake boron nitride tends to build the basis of the heat conduction network in the horizontal direction and improve the in-plane thermal conductivity; spherical boron nitride is conducive to building a heat conduction network in the vertical direction, improving the normal phase thermal conductivity, and further increasing the thermal conductivity of the horizontal direction. Density, so that the polymer-based composite thermally conductive material has good thermal conductivity along the direction of the thermal interface and the direction perpendicular to the thermal interface, and at the same time, the mechanical properties of the polymer-based composite thermally conductive material are still good.

Description

technical field [0001] The invention relates to the technical field of heat-conducting composite materials, in particular to a polymer-based composite heat-conducting material and its preparation method and application. Background technique [0002] With the rapid development of electronic and electrical equipment in the direction of miniaturization, high speed, and high power, untimely heat dissipation will inevitably cause thermal failure, equipment performance degradation, and loss of service life. Therefore, thermal interface materials are particularly important in the thermal management of electronic devices. Currently, polymer materials are widely used as thermal management materials due to their excellent mechanical properties, easy processing, and low cost. [0003] However, the thermal conductivity of polymer materials is very low (about 0.2W·m -1 ·K -1 ), which cannot meet the heat dissipation requirements of modern highly integrated electronic devices. Adding t...

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Problems solved by technology

In most practical applications, the heat from the chip to the heat sink is along the vertical direction ( figure 1 y) transfer, while in the current study, there is less attention on the phase thermal conductivity of the thin-film method

It is currently known that increasing the content of thermally conductive fillers can improve the construction of the thermally conductive network along the cross-sectional direction of the thermal interface. Although this can enhance the normal phase thermal conductivity of the film to a certain extent, it will sacrifice the mechanical properties of the film and make the film brittle. , the flexibility decreases

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